Northrop Grumman Systems Corporation

Westinghouse Electric Corporation

Midori Anzen Co., Ltd.

Westinghouse Electric Company LLC

Edward L Rich, Iii

Patrick K Richard

Scott K Suko

David A Herlihy

John W Cassen

John S Fisher, Iii

David W Strack

Gary N Bonadies

John W Gipprich

Gary L Ferrell

Daniel J Heffernan

Stephanie A Parks

John D Gornto

Andrew J Piloto

Frank E Martin

Albert G Tarrillo

Tapan K Gupta

H Halley Lisle

Brian T Drude

Richard C Kapraun

Daniel L DeLong

Chad E Wilson

Yucel Y Yalim

Keith L Rowe

Kevin L Ebersole

Scott C Tolle

Dennis Schaefer

Angela J Martin

George T Hall

Toby Hess

Daniel H Wenzlick

Kerry M Yon

Ayn U Fuller

Timothy L Eder

Mark R Schrote

Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabrication of the T/R module. The slots are formed prior to the shroud being brazed on to the module substrate. By allowing plating solution to flow through the connector, the interior of the connector can be more thoroughly plated, thereby improving the yield of the assembly while reducing cost.

Plating of brazed RF connectors for T/R modules

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package. The RF transmit power amplifiers which generate most of the heat in the module package are located in a first pair of cavities formed in the substrate directly behind the RF connector assembly and are mounted directly on a pair of flat heat sink plates which are secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate. A second pair of cavities in which are located the RF receive signal amplifiers and their respective receiver protector elements, is located beside the first pair of cavities directly behind the RF connector for reducing RF signal loss.

Dual channel microwave transmit/receive module for an active aperture of a radar system

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The T/R module is one module of an array of like T/R modules coupled to an active aperture of a radar system.

Dual channel microwave transmit/receive module for an active aperture of

A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

Transmit/receive module having multiple transmit/receive paths with

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and are bonded directly to a generally flat a heat sink plate which is secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate. DC power conditioning is also provided by a capacitive bank type of energy storage subassembly externally attached to the rear of the module package for supplying supplementary power to the module during peak power operation. The T/R module is one module of an array of like T/R modules coupled to an active aperture of a radar system.

A DC-DC voltage converter 40, which is adaptable to VHF operation, has a power oscillator 52 to which a filtered input DC voltage 50 is applied for conversion to an output DC voltage. The power oscillator includes a push-pull amplifier 58, 60 and an impedance transformation circuit 62 to which the amplifier is connected. The power oscillator also includes a rectifier circuit 64 which is connected to the impedance transformation circuit. A feedback circuit 68 controls the frequency of the oscillator to regulate the output DC voltage. The oscillator frequency depends on the impedance values of oscillator circuit components and the values of a plurality of oscillator component intrinsic parameters.

Self-oscillating DC-DC converter apparatus and method especially

An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected to a coolant distribution manifold encircling the array; a DC power and logic signal distribution manifold; and, a plurality of elongated DC/logic circuit board members connected to the DC power and logic signal distribution manifold and being respectively located adjacent and coextensive with a respective coldplate for supplying DC power and logic control signals to a DC/logic interface located at the other end portion of the respective modules.

Antenna assembly including dual channel microwave transmit/receive

A power distribution system (12) is provided in radar apparatus to distribute power from a 270 VDC source (60) through an intermediate power converter (70) and very high frequency (VHF) regulator/modulator units (80). Bus conductors (71,74) interconnect the source, the intermediate power converter, and the VHF units. Capacitors (71, 76) are connected to the bus conductors on the input and output sides of the intermediate power converter. Each VHF unit supplies modulating pulses to RF amplifiers (82) of an AESA array of the radar apparatus.

Pulsed radar apparatus and method employing power distribution system

A microwave transmit/receive module comprises a single multi-layer substrate having at least two opposed mounting surfaces. The substrate including a plurality of integrated dielectric layers, electrical conductors and thermal conductors selectively interconnected between the layers of the substrate. A microwave signal processing means is mounted on at least one of the mounting surfaces of the substrate for processing microwave radar signals. A control signal processing means is mounted on at least one of the mounting surfaces of the substrate for providing control signals for the microwave signal processing means via selected electrical conductors. A power conditioning means is mounted on at least one of the mounting surfaces of the substrate for providing power to the microwave signal processing means and the control signal processing means via selected electrical conductors. A heat sink interface means coupled to the thermal conductors is mounted on at least one of the mounting surfaces of the substrate in thermal proximity selected portions of the microwave signal processing means, the power conditioning means and the control signal processing means for conducting thermal energy away therefrom via selected thermal conductors. An optical interface interface as well as an integrated coaxial cable carrying power, control and microwave signals for the module.

Multi-layer single substrate microwave transmit/receive module

A high frequency, transformer capable of operating at high power levels is disclosed. Conductive ribbons including end (terminal) sections which permit the terminal leads of a plurality of windings to be extended from the windings in an overlapping relationship and in the selected order is utilized for the windings. Preferably, the core is formed of a material having low eddy current losses and characteristics permitting the core to be molded such that the windings are substantially surrounded by the core with the exception of small openings through which the leads extend.

High frequency transformer

A control and monitoring system for an oxygen generation device having a plurality of chemical oxygen generation elements sequentially decomposed to continuously generate oxygen. The control and monitoring system has a temperature sensor operatively coupled to each of the chemical oxygen generation elements, except the one to be ignited last, for producing a first control signal in response to the heat generated by the chemical oxygen generation elements during decomposition, a gas flow sensor disposed in the oxygen outlet has the oxygen generation elements and responsive to a flow rate less than a predetermined minimum flow rate to produce a second control signal, a sequential ignition mechanism operated on the occurrence of both the first control signal and the second control signal, as an ignition signal for igniting the oxygen generation elements one after another, and an alarm operative in response to the second control signal after a time interval of not less than a predetermined magnitude for indicating the interruption of oxygen generation for an abnormally long time interval. Preferably, light emitter indicator means are provided to indicate ignition of the corresponding oxygen generating element.

Control and monitoring system for oxygen generating device

A paramagnetic oxygen sensor wherein a reference chamber is oscillated into and out of an air gap of a magnetic circuit by means of a piezoelectric bender bar. The oscillating reference periodically displaces the ambient gas under measurement in the air gap and causes a varying flux in the magnetic circuit which is sensed, amplified and provided as an output signal indicative of the partial pressure of oxygen of the gas mixture.

Magnetic means for determining partial pressure of oxygen particularly

The disclosed gas flow sensor has an orifice connected in an oxygen conduit and a pressure switch connected to the conduit by having a pressure chamber communicating with the conduit. The chamber terminates at a diaphram which is operatively coupled to a normally open microswitch by a spring loaded rod. As the flow rate of oxygen flowing through the conduit drops below a permissible minimum magnitude, back pressure on the orifice decreases so as to close the microswitch to provide a control signal. A bypass valve is connected across the orifice to prevent the oxygen pressure within the conduit from excessively increasing.

Gas flow-sensor for chemical oxygen generation device

Three chlorate candles are connected to a common conduit to which a normally open pressure switch is connected on the downstream side. The switch closes in response to a flow rate less than its predetermined minimum magnitude of oxygen from each candle flowing through the conduit. The pressure switch and one thermal switch for each candle except the last one are serially interconnected across a DC source through a resistor. When that candle first ignited is weakened in generation of oxygen, the next candle is ignited with the closure of the two serially connected switches and through the resulting heating of the associated resistor. The third candle is similarly ignited.

Growing community of inventors

Arnold, MD, United States of America

Edward L Rich, Iii