Intel Corporation

Edward L Martin

Tiffany Byrne

Saikumar Jayaraman

Daewoong Suh

Mitul Bharat Modi

Carolyn R McCormick

Mitesh C Patel

Sankara J Subramanian

Ruben Cadena

Patricia A Brusso

Wei Keat Loh

Sheau Hooi Lim

Stephen E Lehman

Yoong Tatt P Chin

Mohd Erwan B Basiron

Paul A Koning

Carl L Deppisch

L Todd Biggs

An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

Underfill device and method

A composition includes a solder paste matrix and a solder mixture including a tin-based solder alloy. The composition also includes a discrete dispersion of a metal. The tin-based alloy includes a melting first temperature and the metal includes a melting second temperature. The melting second temperature is greater than the melting first temperature. The discrete dispersion is in a particle range of a majority passing minus 520-mesh. A process includes blending the solder mixture and the metal under non-alloying conditions to achieve the discrete dispersion of the metal. A process includes reflowing the composition such that the composition when solidified, has a melting point that is higher than the solder mixture in the composition.

In-situ alloyed solders, articles made thereby, and processes of making same

Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.

Solder bumps formation using solder paste with shape retaining attribute

A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or 'collapsing' of the package substrate toward the printed circuit board.

Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board

Growing community of inventors

Chandler, AZ, United States of America

Edward L Martin