Qualcomm Mems Technologies, Inc.

Qualcomm Incorporated

Snaptrack Incorporated

Edward Keat Leem Chan

Bing Wen

Tallis Young Chang

Yaoling Pan

Chong U Lee

John Hyunchul Hong

Cheonhong Kim

Isak Clark Reines

Ming-Hau Tung

Jian Jim Ma

Alok Govil

Wilhelmus Johannes Robertus Van Lier

Jae Hyeong Seo

Kristopher Andrew Lavery

Brandon Hong

Rihui He

Chih-Hsiang Ho

This disclosure provides systems, methods and apparatus for a display drive scheme without a reset. In one aspect, a first voltage can be applied to an electrode of a display unit to position a movable element from a first position towards a second position, and a second voltage can be applied to the electrode of the display unit to position the movable element to the second position.

Display drive scheme without reset

Various implementations described herein involve interferometric modulators (IMODs), which may be single-mirror IMODs (SMIs). Such IMODs may include an absorber stack and a mirror stack. The absorber stack and the mirror stack may define a gap therebetween and may be capable of being positioned in a plurality of positions relative to one another to form a plurality of gap heights. A hinge area may physically connect the mirror stack and an anchor area. Some such IMODs have hinge areas without any metal layer. However, the hinge area may be capable of forming an electrical connection with at least one metal layer of the mirror stack. For example, such IMODs may have a hinge area that includes a non-metal conductor.

Interferometric modulator mirror design without metal layer in the hinge

This disclosure provides apparatus, systems and methods for an electromechanical systems (EMS) device having one or more flexible support posts. In one aspect, the EMS device includes a substrate, a stationary electrode over the substrate, one or more flexible support posts over the substrate, and a movable electrode over the stationary electrode and supported by the one or more flexible support posts. The movable electrode is configured to move across a gap between the movable electrode and the stationary electrode upon electrostatic actuation, where the one or more flexible support posts include a first organic material and can be configured to compress to permit the movable electrode to move across the gap.

EMS device having flexible support posts

This disclosure provides systems, methods and apparatus for an arrangement of pixels and interconnects in a display. In one aspect, polarities of pixels may be in a dot inversion configuration, or checkerboard pattern, to reduce the visibility of flicker. Various interconnect alternatively couple between modules in different columns or rows to provide dot inversion.

Dot inversion configuration

This disclosure provides systems, methods, and apparatus for an electromechanical systems (EMS) device with one or more protrusions connected to a surface of the EMS device. In one aspect, the EMS device includes a substrate, a stationary electrode over the substrate, and a movable electrode over the stationary electrode. The movable electrode is configured to move to three or more positions across a gap by electrostatic actuation between the movable electrode and the stationary electrode. When the protrusions contact any surface of the EMS device at one of the positions across the gap, the protrusions change the stiffness of the EMS device. At least one of the surfaces in contact with the one or more protrusions is non-rigid. In some implementations, the protrusions have a height greater than about 20 nm.

Electromechanical systems device with protrusions to provide additional stable states

This disclosure provides systems, methods and apparatus for a thin film stack with surface-conditioning buffer layers. In one aspect, the thin film stack includes a plurality of thin film layers each having a thickness greater than about 10 nm and a plurality of surface-conditioning buffer layers each having a thickness between about 1 nm and about 10 nm. The surface-conditioning buffer layers are alternatingly disposed between the thin film layers. Each of the surface-conditioning buffer layers are formed with the same or substantially the same thickness and composition. In some implementations, the surface-conditioning buffer layers are formed by atomic layer deposition.

Thin film stack with surface-conditioning buffer layers and related methods

Growing community of inventors

San Diego, CA, United States of America

Edward Keat Leem Chan