The Boc Group, Inc.

Osaka Sanso Kogyo Ltd.

Edward K Chang

Mark J Kirschner

John P Collier

Harbhajan S Nayar

Shuen-Cheng Hwang

Paul Francis Stratton

Richard C Paciej

John J Dwyer, Jr

Iku Takenaka

Yoshiharu Tsujimoto

Weiji Huang

Satish S Tamhaukar

John Connors

Hiromitsu Onishi

A burner construction having a body portion fabricated from a base material and coating material covering the base material. The base material is formed of copper or copper alloy having a conductivity of no less than about 100 watts/meter/.degree. C. Alternatively the base material can be silver. The coating material comprises nickel or nickel based alloy which can be an autocatalytic plating.

Burner construction

The present invention is directed to a method for forming a heat treating atmosphere in which a nitrogen rich gas containing small amounts of oxygen is preheated. An oxygen-reactive gas, such as a hydrocarbon gas, is combined with the nitrogen rich gas and the mixture is reacted outside of the furnace at temperatures above which substantial sooting does not occur. The resulting heat treating atmosphere is then forwarded to the furnace for conducting the heat treating process.

Method for forming heat treating atmospheres

A method of depositing a solid substance on the surface of the substrate in which the solid substance is dissolved in a solvent to create a first solution. The solid substance is less freely divided prior to dissolution than when deposited on the substrate and the deposition density of the solid substance on the substrate is regulated at least in part by solid substance concentration. The solid substance is insoluble in a liquified gas and the first solution is soluble in the liquified gas. The solvent also is capable of depressing the freezing point of the liquified gas upon expansion of the liquified gas. The first solution is dissolved in the liquified gas to create a second solution having a sufficient concentration of the solvent relative to the liquified gas that solidification of the liquified gas is substantially prevented upon the expansion thereof. Preferably, this concentration of solvent is a minimum to prevent overuse of environmentally hazardous solvents. The solution is sprayed against the substrate so that a portion of the liquified gas flashes into a vapor and the second solution containing a remaining portion of the liquified gas contacts and thereby coats the surface substrate. The remaining portion of the liquified gas is evaporated along with the solvent, so that the solid substance remains as a deposit on the substrate. The method has particular application to making very free depositions such as are required in the electronics industry to coat contacts of printed circuit boards with flux prior to soldering.

Method of depositing solid substance on a substrate

A method of soldering for surface mounting of a printed circuit board, which comprises performing reflow soldering with a rosin-based cream solder in a special atmospheric gas comprising an inert gas such as N.sub.2, Ar or He and containing about 10,000 ppm or less of oxygen and 0.5-3.0% of moisture is disclosed.

Method of soldering using a special atmospheric gas

A method of forming a copper circuit pattern on a ceramic substrate. In accordance with the method, first and second layers of copper oxide and copper are applied to the ceramic substrate. Selected regions of the copper are then masked so that unmasked regions are formed on the copper in a configuration of the copper circuit pattern. Masked regions are formed on the copper adjacent the unmasked regions, where copper cannot be plated. The unmasked regions of the copper are plated in a neutral pH solution by a reverse pulse plating process. The masking is then removed and the copper and copper oxide layers are etched so that the copper and copper oxide is removed from the unmasked regions. Thereafter, the remaining copper is direct bonded to the substrate.

Method of forming a copper circuit pattern

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Gillette, NJ, United States of America

Edward K Chang