Advance Micro Devices, Inc.

Edward Jr I Cole

Michael R Bruce

Rosalinda M Ring

Victoria Jean Bruce

Charles F Hawkins

Paiboon Tangyungong

According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.

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Albuquerque, NM, United States of America

Edward Jr I Cole