Cvc Products, Inc.

Edward J Nagy

Mehrdad M Moslehi

Thomas R Omstead

William J Messner

William Starks

Panya Wongsenakhum

A method and system for fabricating a device on a substrate with a process gas, such as with chemical vapor deposition. A reaction chamber and support chuck cooperate to form a low conductance configuration for axisymetric process gas flow over the substrate and to form a high conductance configuration for enhanced evacuation of residual process gas from the reaction chamber upon completion of the process. A dual conductance chuck has an indented region that aligns with the exhaust port of the reaction chamber to restrict process gas flow in the low conductance configuration, and that moves distal a showerhead and the exhaust port to provide reduced restriction of process gas flow for reaction chamber evacuation. The chuck includes thermal control for enhancing film deposition on the substrate and for reducing residual film deposition on the chuck. An evacuation opening in the housing provides independent evacuation of residual gas from the housing. The present invention enhance throughput of device formation by reducing purge and process cycle times.

Apparatus for supporting a substrate in a reaction chamber

System for fabricating a device on a substrate with a process gas

Apparatus for dispensing gas for fabricating substrates

Method for fabricating a device on a substrate

Method and system for dispensing process gas for fabricating a device on a substrate

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Cypress Mill, TX, United States of America

Edward J Nagy