Western Electric Company, Inc.

At&t Technologies, Inc.

Edward J March

Roy C Carlson, Jr

Raymond J Newman

Brian E Jacobs

George Michael Wenger

Roland Ellis, Jr

A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.

Technique for bonding a chip carrier to a metallized substrate

Vapor condensation mass soldering apparatus (46) is of modular construction and includes a primary vapor zone assembly (50), a secondary vapor zone assembly (52), an ambient air moisture-removal zone assembly (54) and a hood assembly (56) mounted in readily separable, vertically stacked relationship. An article load-unload assembly (48) is secured to the front of the other assemblies (50, 52, 54 and 56). Each of the zone assemblies (50, 52 and 54) also includes respective condenser coil modules (142, 150 and 154) of special construction which can readily be mounted on and removed from their respective assemblies as integral units.

Vapor condensation apparatus having condenser coil modules

A condensation soldering facility (10) comprised of a housing (12) having a divider member (22) therein which separates the housing into a drying chamber (24) in an upper section and a soldering chamber (26) in a lower section. A transfer member (76) is pivotably mounted within the drying chamber (24) to receive articles (112--112) to be soldered through an access door (71) in the top of the drying chamber (24) and arcuately transfer the articles through an access door (44) in the divider member (22) to solder the articles in the soldering chamber (26).

Single vapor condensation soldering facility

A flux filtration system (10) for removing rosin flux from a heat transfer liquid (14). The flux and heat transfer liquid (14) on an article (17) that has been condensation soldered is drained into a pan (13) located within a condensation soldering facility (11). The pan (13) diverts the liquid-flux mixture from a boiling reservoir of the liquid (14) in the lower portion of the facility (11). The liquid-flux mixture drained during a plurality of batch soldering operations is accumulated in a coarse flux filter (21). Periodically the filter (21) outpulses the coarsely filtered material sequentially through a heat exchanger (23), a fine flux filter (24), a preheater (28) and is then returned to the reservoir in the facility (11). When the liquid-flux mixture is not being outpulsed from the filter (21), the liquid (14) from the reservoir flows into the heat exchanger (23) and passes through the remainder of the filtration system (10) to maintain a flow therethrough to clean the system and prevent buildup of flux within the system (10).

Rosin flux filtration system

A technique for elevating the temperature of a heat transfer liquid is disclosed. The liquid, at a low temperature (e.g., 70.degree. F.), is directed through a coil (72) located in the upper portion of an enclosed chamber (71). Condensing, hot vapor on the coils (72) heats the liquid (e.g., 200.degree. F.) passing therethrough. The heated liquid from the coil (72) passes, via a conduit (73) into a reservoir in the lower portion of the chamber (71) where immersion heaters (76-76) heat the liquid (e.g., 400.degree. F.) to the desired temperature. The heated liquid is then discharged from the chamber (71) via an outlet pipe (74). Advantageously, the vapor from the heated liquid in the reservoir is the same vapor which condenses on the coils (72).

Technique for elevating the temperature of a fluid

A filter (21) for removing flux from a hot heat transfer liquid-flux mixture. The heat transfers liquid-flux mixture is directed into a chamber (41) having a plurality of spaced, hollow members (64--64) through which a coolant passes. Upon being cooled the flux deposits on the surface of the members (64--64). The liquid, with substantial portions of the flux removed therefrom, then leaves the filter (21).

Flux filter

A high pressure steam condensation soldering facility (10) is described. The facility (10) incorporates a chamber (12) having a centrally located heat processing zone (45) into which high pressure steam is injected to reflow solder on articles (43) therein. A baffle (41) having a conical top portion (51) with a plurality of apertures (52) therein permits controlled amounts of the steam to pass therethrough while redirecting a portion of the steam along the wall (16) of the chamber (12) to interpose a shield of steam between the wall and uniformly heated processing zone (45).

Growing community of inventors

Lower Makefield, PA, United States of America

Edward J March