Incep Technologies, Inc.

Other

Molex Corporation

Callaway Golf Company

Edward J Derian

Joseph Ted Dibene, Ii

David H Hartke

Carl E Hoge

James M Broder

Peter L Soracco

J Andrew Galloway

Ronald K Hettinger

Herbert Reyes

Daniel R Jacobson

Andrew J Goodjohn

Joseph T DiBene

Paul D Zanolli

David J Hartke

Joseph S Riel

Jose B San Andres

A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

System and method for processor power delivery and thermal management

An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.

Micro-spring interconnect systems for low impedance high power applications

Ultra-low impedance power interconnection system for electronic packages

The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.

Integrated power delivery and cooling system for high power microprocessors

A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.

Separable power delivery connector

A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

Apparatus for delivering power to high performance electronic assemblies

A golf club ( ) with an internal hosel ( ), a shaft ( ) and a hosel liner ( ) is disclosed herein. The hosel liner ( ) reduces axial stress on the shaft ( ) during impact of the golf club ( ) with a golf ball. The hosel liner ( ) is preferably composed of a polycarbonate material that has a flexural modulus in the range of 300,000 pounds per square inch to 1,000,000 pounds per square inch. Preferably, the golf club head ( ) has a large volume, greater than 300 cubic centimeters, and weighs less than 215 grams. Preferably, the shaft ( ) is composed of graphite and weighs between 40 grams to 80 grams.

Golf club with hosel liner

Growing community of inventors

San Diego, CA, United States of America

Edward J Derian