Harris Corporation

Edward J Bajgrowicz

Douglas E Heckaman

Jeffrey A Frisco

Roger H Higman

Gregory M Jandzio

Walter M Whybrew

Gary A Rief

William Edward Clark

Brett A Pigon

James B Nichols

Randy Eugene Boozer

Gregory C Rieder

An interconnect structure interconnects electronic modules and includes a backplane assembly formed from a substantially rigid backplane plate that carries RF connectors and a digital motherboard having digital connectors for mating with digital connectors of electronic modules. A controlled impedance interconnect circuit is positioned on the rear surface of the backplane plate and interconnects the RF connectors carried by the backplane plate and digital connectors of the digital motherboard. A rack receives the backplane assembly and supports a plurality of electronic modules that are interconnected to each other via the backplane assembly.

Interconnect structure for interconnecting electronic modules

A phased array antenna includes an antenna housing having a subarray assembly that supports beam forming network modules and an array face defining a ground plane substantially orthogonal to the subarray assembly. A plurality of millimeter wavelength patch antenna elements are positioned on the array face and each positioned adjacent a respective subarray assembly. The millimeter wavelength patch antenna elements each include a driven antenna element having a front and rear side and a parasitic antenna element positioned forward of the front side of the driven antenna element. A microstrip quadrature-to-circular polarization circuit is positioned rearward of the rear side of the driven antenna element and operatively connected to the driven antenna element. A single millimeter wavelength feed operatively connects the microstrip quadrature-to-circular polarization circuit with a respective adjacent beam forming network module supported on the orthogonal positioned subarray assembly.

Phased array antenna having stacked patch antenna element with single millimeter wavelength feed and microstrip quadrature-to-circular polarization circuit

A package for a microwave circuit chip and associated microstrip antenna is formed of a multi-layer ceramic laminate within which is supported a microwave chip carrier and on an outer surface of which a microstrip antenna disposed. A first ceramic layer is supported on metallic base member and contains signal lines for interfacing the chip with the external world. Disposed atop the first ceramic layer is a second ceramic layer which forms a protective seal ring around the perimeter of the chip. A third ceramic cover layer is mounted atop the seal ring layer and contains one or more antenna elements on its outer surface. Signal line connections between the chip and the antenna elements are effected through tuned networks that extend from signal leads on the chip to conductors on the first ceramic layer. Signal connections from the first ceramic layer to the antenna on the cover may be formed by conductive vias through the ceramic seal ring layer or conductors along sidewalls of the seal ring layer and cover. Preferably, the first layer and the seal ring layer contain a ground plane vias distributed around the perimeter of the chip, to provide electrical continuity between the metal base member and a ground plane on the interior surface of the cover.

Microwave chip carrier package having cover-mounted antenna element

A miniaturized transmission link architecture for intercoupling high frequency miniaturized integrated circuit components comprises a thin conductive plate in one surface of which a matrix or grid work of rectilinear grooves or channels are formed, creating 'waffle-iron'-like pattern in one surface of the conductive plate. The spacing between channels corresponds to the width of a channel which, in turn, may be sized to substantially match the outer diameter of insulation jacketed wire that is placed in the channels. The depth of a channel or groove is slightly larger than the outer diameter of the wire to accommodate wire crossovers at intersections of the channels. The top surface of the 'waffle-plate' is provided with a conductive foil to complete the shielding for the wires. Because the waffle structure has the same periodicity along either of the orthogonal directions of the channels, the characteristic impedance of the transmission link is readily defined by the size of the lands or mesas that are bounded by the channels and the widths of the channels themselves.

Waffleline - configured transmission link

Waffleline-configured microwave transmission link

Growing community of inventors

Palm Bay, FL, United States of America

Edward J Bajgrowicz