Advanced Micro Devices Corporation

Other

Fasl LLC

Spansion Llc.

Edward Hsia

Darlene G Hamilton

Kulachet Tanpairoj

Yi He

Mark W Randolph

Edward Franklin Runnion

Alykhan Madhani

Mimi Lee

Jose H Hernandez

Binh Quang Le

Eric M Ajimine

Sayan Suanya

Mark T Ramsbey

Hidehiko Shiraiwa

Kazuhiro Kurihara

Pau-Ling Chen

Wei Zheng

Zhizheng Liu

Yider Wu

Tazrien Kamal

Ming-Huei Shieh

Jean Yee-Mei Yang

Emmanuil Lingunis

Pauling Chen

Ken Tanpairoj

Phuong K Banh

Eric Ajimine

Edward Runnion

Emmanuil Manos Lingunis

A method of erasing a flash electrically erasable read only memory (EEPROM) device composed of a plurality of memory cells includes pre-programming the plurality of memory cells, applying an erase pulse to the plurality of memory cells followed by an erase verification. The erase verification is followed by soft programming any memory cells having a threshold voltage below a predetermined minimum level and applying a positive gate stress to the plurality of memory cells. The erase method prevents overerasing and provides a tightened threshold voltage distribution.

Memory device and method using positive gate stress to recover overerased cell

A method of programming a multi-level, dual cell memory device. The method includes independently programming a first charge storing cell and a second charge storing cell to respective data states, the data states selected from a blank program level or one of a plurality of charged program levels. Also disclosed is a method of reading the multi-level, dual cell memory device using a plurality of reference currents.

Method of programming dual cell memory device to store multiple data states per cell

An erase methodology of flash memory cells in a multi-bit memory array with bits disposed in normal and complimentary locations. An erase verify of bits in the normal locations is performed and if a bit in the normal location fails and if the maximum erase pulse count has not been reached, erase pulses are applied to both the normal bit and the complimentary bit. An erase verify of bits in the complimentary locations is performed and if a bit in the complimentary location fails and if the maximum erase pulse count has not been reached, erase pulses are applied to both the complimentary and the normal bit locations. If the bits pass the erase verify, the bits are subjected to a soft programming verify. If the bits are overerased and if the soft programming pulse count has not been reached a soft programming pulse is applied to the overerased bit.

Erase method for a dual bit memory cell

A method of programming a dual cell memory device having a first charge storing cell and a second charge storing cell. The method can include applying an initial program pulse to the memory device; comparing the threshold voltage of the memory device with a verify threshold voltage; and if the threshold voltage of the memory device is less than the verify threshold voltage, applying a second program pulse to the memory device during which at least one condition of the second program pulse is modified from the initial program pulse.

Method of controlling program threshold voltage distribution of a dual cell memory device

A method of determining charge loss activation for a memory array. Memory arrays are programmed with a pattern for testing charge loss. Then, respective bake times are calculated for the memory arrays to experience a given amount of charge loss at their respective bake temperatures. Then, charge loss activation energy is calculated, based on the respective bake times. In one version, the memory arrays are cycled by repeatedly erasing and reprogramming them before baking. In another embodiment, various regions of the memory arrays are programmed to a plurality of distinct delta threshold voltages before baking.

Method of determining charge loss activation energy of a memory array

A non-volatile memory read circuit having adjustable current sources to provide end of life simulation. A flash memory device comprising a reference current source used to provide a reference current for comparison to the current of a memory cell being read, includes an adjustable current source in parallel with the memory cell being read, and an adjustable current source in parallel with the reference current source. The current from the memory cell, reference current source, and their parallel adjustable current sources are input to cascode circuits for conversion to voltages that are compared by a sense amplifier. The behavior of the cascode circuits and sense amplifier in response to changes in the memory cell and reference current source may be evaluated by adjusting the adjustable current sources so that the combined current at each input to the sense amplifier simulates the current of the circuit after aging or cycling.

Non-volatile memory read circuit with end of life simulation

A method of programming a dual cell memory device having a first charge storing cell and a second charge storing cell. According to one aspect of the method, the method can include over-erasing the first and second charge storing cells to shift an erase state threshold voltage of the memory device to be lower than a natural state threshold voltage. According to another aspect of the method, the method can include programming the first and second charge storing cells to the same data state and verifying that the second programmed charge storing cell stores charge corresponding to the data state. If the verification fails, both charge storing cells can be re-pulsed.

Method of dual cell memory device operation for improved end-of-life read margin

A method of programming a dual cell memory device having a first charge storing cell and second charge storing cell. The first charge storing cell can be pre-read to determine if the first charge storing cell stores an amount of charge to increase a threshold voltage of the memory device over a specified threshold voltage. If not, the second charge storing cell can be programmed with a standard program pulse. If so, the second charge storing cell can be programed with a modified program pulse.

Method of programming a dual cell memory device

An array of non-volatile memory cells includes active columns of cells wherein a data pattern may be stored adjacent to damaged or inactive columns wherein data is not stored. A method of storing a data pattern and reproducing the data pattern within such an array comprises storing a charge within a selected plurality of the memory cells within the active column. The selected plurality of memory cells represents a portion of the data pattern. An inactive memory cell programming pattern is identified. The inactive memory cell programming pattern identifies all, or a selected plurality, of the memory cells in the inactive column in which a charge is to be stored for the purpose of periodically storing a charge in the memory cells first inactive column to prevent over erasure, during bulk erase, and leakage from the inactive cells to adjacent active cells. A charge is stored on the selected plurality of the memory cells in the first inactive column. The data pattern is reproduced reading each memory cell within the first active column.

Method for reading a non-volatile memory cell adjacent to an inactive region of a non-volatile memory cell array

A method of programming and reading a dual cell memory device. The method includes storing a selected program level in each cell and reading one of the cells to determine a single data value stored by the memory device.

Method of programming and reading a dual cell memory device

One aspect of the present invention relates to a method of forming a SONOS type non-volatile semiconductor memory device, involving forming a first layer of a charge trapping dielectric on a semiconductor substrate; forming a second layer of the charge trapping dielectric over the first layer of the charge trapping dielectric on the semiconductor substrate; optionally at least partially forming a third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric; forming a source/drain mask over the charge trapping dielectric; implanting a source/drain implant through the charge trapping dielectric into the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric; and one of forming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, reforming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, or forming additional material over the third layer of the charge trapping dielectric.

Source drain implant during ONO formation for improved isolation of SONOS devices

A method of utilizing Fast Chip Erase to screen endurance rejects. Multiple sectors in a device are selected and a time necessary to program all cells in the sectors is monitored and if the monitored time exceeds a first time, the device fails. A time necessary to erase all the cells without any overerased cells is monitored and if the time exceeds a second time, the device fails. A time necessary to correct overerased cells is monitored and if the time exceeds a third time, the device fails. The total time from erase until overerase correction is achieved is monitored and if the total time exceeds a fourth time, the device fails. The total time to determine erasability is monitored and if this time exceeds a fifth time, the device fails.

Method of utilizing fast chip erase to screen endurance rejects

In a semiconductor manufacturing process for manufacturing memory devices a method of screening hot temperature programmability rejects in memory devices during wafer sort at room temperature that would be rejected at class test at high temperature. All cells in the memory device are subjected to a first sequence of programming pulses at a voltage lower than the standard programming voltage. The number of pulses in the first sequence of programming pulses is from 1-5. Those die that verify as having been successfully programmed are passed. Those die that do not verify as having been programmed are subjected to a second sequence of programming pulses at a voltage lower than the standard programming voltage. The number of pulses in the second sequence of programming pulses is from 10 to 15 pulses. Those that verify as being programmed are marked as good and those that do not are repaired and retested.

Method of screening memory cells at room temperature that would be

In a semiconductor manufacturing process for manufacturing memory devices a method of screening hot temperature erase rejects in memory devices during wafer sort at room temperature that would be rejected at class test at high temperature. Selected cells of the memory device are subjected to a first sequence of erasure pulses at a high voltage until the selected cells are verified erased or until a first maximum number of erasure pulses has been reached, recording the number of pulses required to erase the selected cells, reading and repairing any defective memory cells, and subjecting all cells to a second sequence of erasure pulses until all cells are verified erased or until a maximum number of pulses has been reached wherein the second maximum number is a multiple of the recorded number.

Method of screening hot temperature erase rejects at room temperature

A method of testing Flash memory devices by performing wafer sort testing on main array cells and redundancy array cells of the Flash memory device and performing class testing on redundancy array cells only. There is a major savings of testing time with no decrease in quality of the final product.

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Saratoga, CA, United States of America

Edward Hsia