Hitachi Global Storage Technologies Netherlands B.v.

Hgst Netherlands, B.v.

International Business Machines Corporation

Hitachi Global Storage Technologies

Western Digital Technologies, Inc.

Hitachi Global Technologies Netherlands B.v.

Hitachi Global Storage Technologies B.v.

Edward Hin Pong Lee

Vladimir Nikitin

Wen-Chien David Hsiao

Aron Pentek

David John Seagle

Sue Siyang Zhang

Quang Le

Richard Hsiao

Neil Leslie Robertson

Yimin Hsu

Hung-Chin Guthrie

Amanda Baer

David Patrick Druist

Daniel Wayne Bedell

Eric James Lee

Son Van Nguyen

Ming Jiang

Yi Zheng

Quan-chiu Harry Lam

Samuel Wei-san Yuan

Michael Ming Hsiang Yang

Wenchein Hsiao

Bradley Douglas Webb

Jennifer Ai-Ming Leung

Tsann Lin

Ashok Lahiri

Hugo Alberto Emilio Santini

Glen A Garfunkel

Patrick Rush Webb

Ning Shi

Hong Xu

Katalin Pentek

Kuok San Ho

Kim Yang Lee

Yingjian Chen

Murali Ramasubramanian

Thomas Young Chang

Denny Tang

Paul Phong Nguyen

Howard Gordon Zolla

Changqing Shi

Jui-lung Li

Ying Hong

Chie Ching Poon

Tsung Yuan Chen

Diane L Brown

Samuel Wonder Yuan

Yinshi Liu

Nian Xiang Sun

Donald Giles Allen

Joseph Francis Smyth

Terence Tin-Lok Lam

Samuel Weisan Yuan

Robert Langland Smith

Peter Beverley Powell Phipps

Jeffrey Gregory McCord

Yuan Yao

Hardayal Singh Gill

Thomas R Albrecht

Robert Fontana

Zhigang Bai

John Thomas Contreras

Jeffrey Scott Lille

Liubo Hong

Ching Hwa Tsang

Petrus Antonius Van Der Heijden

Andrew Ching Tam

Surya Narayan Pattanaik

Alexander Goncharov

Muhammad Asif Bashir

Yunfei Ding

Randall George Simmons

Yong Shen

Chun-Ming Wang

Jyh-Shuey Jerry Lo

Satoru Araki

Savas Gider

James Terrence Olson

Ian Robson McFadyen

Guomin Mao

Darrick Taylor Smith

Christian Rene Bonhote

Ciaran Avram Fox

Yansheng Luo

Andrew Chiu

Xinjiang Shen

Hieu Lam

Yuming Zhou

Xiaoyu Sui

Timothy J Moran

Kyusik Shin

John Jaekoyun Yang

Eric Wayne Flint

Shiwen Huang

Gautam Khera

John W Lam

Saad K Doss

Tom King Harris, Iii

Kenneth Donald Mackay

Wolfgang Goubau

The present disclosure is generally related to a magnetic recording device comprising a magnetic recording head having a current flow in a cross-track direction around a main pole. The magnetic recording device comprises a main pole disposed between a trailing shield, a leading shield, and side shields. A trailing gap is disposed between the main pole and the trailing shield. A hot seed layer is disposed between the trailing gap and the trailing shield. A first insulation layer is disposed between the hot seed layer and the trailing shield, where the first insulation layer contacts the side shields. A second insulation layer is disposed between the main pole and leading shield, where the second insulation layer contacts the side shields. The first and second insulation layers direct the current through the side shields and across the main pole in a cross-track direction.

Cross track current design for energy assisted magnetic recording

Embodiments of the present disclosure generally relate to tape drives used for magnetic recording on tapes. Tape drives use tape heads that comprise a read head, a write head, and an additional head that may be a write head or a read head. The tape head is fabricated over a common substrate with the first head being formed first, followed by a shield layer, followed by the second head, followed by another shield layer, and finally followed by the third head. Fabricating the tape head over a common substrate is cost effective. The tape head can be wired such that fewer parallel connections between the heads and bond pads are present. As such, cross-talk between the wires and noise is reduced.

Shielding between heads for tape drive

Approaches for a magnetic write head having a stacked coil architecture. Embodiments utilize the better process control capability available with thin films' thicknesses, compared to the control capability of vertical gap-filling processes, which provides for better scalability to shorter yoke length magnetic write heads, which are faster at writing data bits than are magnetic write heads having a longer yoke length.

Magnetic write head having a stacked coil architecture for high data rate performance

Embodiments described herein generally relate to resistive shunt design in a read sensor for providing accurate measurements from an electronic lapping guide (ELG). More specifically, embodiments described herein relate to a transducer resistor shunt structure for low cost probing. A bleed resistor network for a read sensor may comprise one or more first resistors arranged in parallel with one another and a second resistor arranged in series with the one or more first resistors. The resistor arrangement may require a small physical area and reduce or prevent ELG measurement errors.

Transducer resistor shunt structure for low-cost probing

Embodiments of the present invention generally relate to a magnetic device having a discontinuous array of columns disposed near a magnetic pole. Each column has a length extending perpendicular to an air bearing surface and a width. The length is greater than the width.

Stiff discrete insert array for thermal PTR management with desired induced stress state that reduces tendency for write pole erasure

Approaches for a magnetic write head having an adjacent coil architecture, wherein a coil turn is fabricated immediately adjacent to the writer main pole. The adjacent coil portion essentially lies on the main pole, except for a very thin layer of insulation atomically layered in between. The adjacent coil portion is also substantially closer to the wrap-around shield in comparison with conventional coil configurations. Further, the other upper coil portions may be fabricated to essentially lie on the stitch pole, again except for a very thin atomic layer deposited layer of insulation layered between. This adjacent coil configuration provides a writer coil configuration that concentrates the coil structure significantly closer to the main pole surface, as well as concentrates more of the coil structure closer to the main pole tip, providing for a more efficient and faster write head.

Magnetic write head having a coil adjacent to the main pole

A write head includes a first pole P1, a P1 pedestal, a first back gap layer plated on top of the first pole P1 leaving a region between the P1 pedestal and the first back gap layer for plating a coil. Further, a first insulation layer is applied on top of the P1 pedestal and the first back gap layer and the region between the P1 pedestal and the first back gap layer. The write head further includes a coil, patterned at least partially on top of the P1 pedestal and the first back gap layer and the region between the P1 pedestal and the first back gap layer, copper plated in the coil patterns, and a second insulation layer is applied to fill the spaces in between the coil turns. The resulting structure is planarized via chemical mechanical polishing.

Self-aligned coil process in magnetic recording heads

A write head for use in a magnetic disk drive and methods of manufacturing the same. When a non-magnetic reactive ion etching (RIE) stop layer is used in a damascene main pole fabrication process, the leading edge shield and the side shield have a magnetic separation. By replacing a non-magnetic RIE stop layer with a magnetic RIE stop layer, no removal of the RIE stop layer around the main pole is necessary. Additionally, the leading edge shield and the side shield will magnetically join together without extra processing as there will be no magnetic separation between the leading edge shield and the side shield.

Use of magnetic material for RIE stop layer during damascene main pole formation

A magnetic write head for perpendicular magnetic data recording. The write head includes a substrate and a magnetic write pole formed on the substrate, the write pole having a trailing edge and first and second sides. A magnetic stitched pole is formed over a portion of the magnetic write pole, the stitched pole having a front edge that defines a secondary flare point. First and second non-magnetic side walls are formed at the first and second sides of the write pole. The non-magnetic side walls extend from the substrate at least to the trailing edge of the write pole in a first region near an air bearing surface and wherein the first and second non-magnetic side walls extend from the substrate to a point between the substrate and the trailing edge, allowing the stitched magnetic pole to extend partially over the sides of the write pole.

Perpendicular magnetic write head having a novel shield structure

A magnetic head according to one embodiment includes an array of sensor structures formed on a common substrate. Each sensor structure further comprises: a magnetic tunnel junction sensor spaced from a media-facing surface of the head; and a flux guide between the media-facing surface of the head and the sensor, the flux guide guiding magnetic flux from a magnetic medium adjacent the media-facing surface to the sensor. Additional systems and methods are also presented.

Self-aligned double flux guided TMR sensor

A magnetic write head having a write pole with a tapered trailing edge. The write head has a non-magnetic step layer and a non-magnetic bump formed on the front edge of the magnetic step layer. A non-magnetic trailing gap layer is formed over the tapered trailing edge of the write pole and over the non-magnetic bump and over the non-magnetic step layer. A magnetic trailing shield is formed over at least a portion of the non-magnetic gap layer.

Perpendicular magnetic write head with wrap-around shield, slanted pole and slanted pole bump fabricated by damascene process

In one embodiment and method of the present invention, a coil of a write head is created by forming a Ppedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

Process of manufacturing low resistance damascene coils

The subject matter disclosed herein provides methods for manufacturing an electronic lapping guide and a magnetic read head assembly. The magnetoresistive head assembly includes a sensing element that has a front edge and a front flux guide that has a back edge, such that the sensing element front edge and the front flux guide back edge share a common interface that defines an interface plane normal to the surface of a wafer substrate. The electronic lapping guide comprises a conductive material adapted to attach to two electrical leads for measuring a resistance through the conductive material. The conductive material may include a conductive material back edge aligned with the interface plane. The resistance of the conductive material may be inversely proportional to a conductive material length normal to the interface plane.

Fabrication of magnetoresistive sensors and electronic lapping guides

A method and apparatus for providing a write head with an improved pole tip to improve overwrite and/or adjacent track interference. A cross pole tip writer is provided with a shape that is designed to reduce the saturation on the pole tip and aid in the concentration of flux to the down track.

Method and apparatus for providing a write head with an improved pole tip to improve overwrite and/or adjacent track interference

A system in one approach includes a sensor stack formed of a plurality of thin film layers; a shunt formed of at least some of the same layers as the sensor stack, the shunt being spaced from the sensor stack; a first lead coupled to the sensor stack and the shunt; and a second lead coupled to the sensor stack and the shunt. A method in one embodiment includes forming a plurality of thin film layers; removing a portion of the thin film layers for defining at least a portion of a sensor stack and at least a portion of a shunt spaced front the sensor stack; forming a first lead coupled to the at least a portion of the sensor stack and the at least a portion of the shunt and a second lead coupled to the at least a portion of the sensor stack and the at least a portion of the shunt. Additional systems and methods are also presented.

Methods and systems for using resistivity of sensor film in an element shunt

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San Jose, CA, United States of America

Edward Hin Pong Lee