Tel Fsi, Inc.

Tel Manufacturing and Engineering of America, Inc.

Fsi International, Inc.

Tfl Fsi, Inc.

Edward Hanzlik

Kevin L Siefering

Gregory Paul Thomes

Robert E Larson

David C Zimmerman

Christina Ann Rathman

Brian D Hansen

Mark Goluch

Michael Gruenhagen

Arne C Benson

Sean Moore

Tim W Herbst

The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.

Pressure control strategies to provide uniform treatment streams in the manufacture of microelectronic devices

Cleaning systems and methods for semiconductor fabrication use rotatable and translatable chuck assemblies that incorporate a compact drive system to cause chuck rotation. The system uses an offset drive gear that drives a ring gear. This reduces components whose friction or lubricants might generate undue contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments.

Translating and rotating chuck for processing microelectronic substrates in a process chamber

The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber. control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.

Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. In particular, an improved nozzle design used to expand the fluid mixture is disclosed herein. In one embodiment, the nozzle design incorporates a two nozzle pieces are combined to form a single nozzle design, in which the two pieces are slight misaligned to form a unique orifice design. In another embodiment, two pieces are combined and aligned along a common axis of the fluid conduit. However, an offset piece is inserted between the two pieces and has a hole that misaligned from the flow conduits of the two other pieces.

Apparatus for spraying cryogenic fluids

A wafer edge lift pin of an apparatus for manufacturing a semiconductor device is described. The wafer edge lift pin includes an offset top section containing a notch portion to support and laterally confine the wafer. The notch portion horizontally sweeps away from the wafer along a radius so that rotation adjusts lateral confinement of the wafer. A base section below the top section has a diameter greater than a diameter of the top section across the notch portion to help strengthen the pin and to allow perpendicular mounting. A bottom section has a diameter that is smaller than the diameter of the base section and provides a boss feature to mount the lift pin. The apparatus includes a process chamber where the wafer is processed, a chuck assembly on which the wafer is loaded. At least three wafer edge lift pins move the wafer up and down.

Wafer edge lift pin design for manufacturing a semiconductor device

An apparatus for treating the surface of a microelectronic workpiece via impingement of the surface with at least one fluid and a method for operating the apparatus are described. In particular, the apparatus includes a treatment chamber defining an interior space to treat the microelectronic workpiece with at least one fluid within the treatment chamber, and a movable chuck that supports the workpiece within the treatment chamber. The apparatus further includes a workpiece translational drive system configured to translate the movable chuck between a workpiece load position and at least one processing position at which the workpiece is treated with the at least one fluid using at least one nozzle connected to at least one fluid supply, and a workpiece rotational drive system configured to rotate the microelectronic workpiece.

Apparatus and method for scanning an object through a fluid stream

Apparatus and method for scanning an object through a fluid spray

A rotary union having a housing, a rotor, and a post such that a fluid can be conveyed through the rotary union. The rotor is rotatably coupled to the housing, preferably by at least one bearing interposed between a portion of the rotor exterior and a portion of the housing interior. The post is positioned in the rotary union in a manner effective to help fluidly couple the rotor to the housing and such that an annular gap surrounds at least a portion of the post such that the annular gap constitutes at least a portion of a drain fluid pathway. The present invention also includes fluid delivery systems including such rotary unions and methods of making and/or using such rotary unions.

Growing community of inventors

Shorewood, MN, United States of America

Edward Hanzlik