Harris Corporation

Other

Eagle Technology, LLC

Edward G Palmer

Charles Michael Newton

Christopher A Myers

Albert Sanchez

Francis Eugene Parsche

Walter M Whybrew

Gregory M Jandzio

Alan William Mast

Steven Robert Snyder

Jay D Warshowsky

Veronica Palmer

A radio frequency (RF) satellite antenna may include an antenna housing to be carried by the satellite and having first and second opposing antenna element storage compartments. The antenna may further include a first plurality of self-deploying conductive antenna elements moveable between a first stored position within the first antenna element storage compartment, and a first deployed position extending outwardly from the canister and defining a first conical antenna. The antenna may also include a second plurality of self-deploying conductive antenna elements moveable between a second stored position within the second antenna element storage compartment, and a second deployed position extending outwardly from the canister and defining a second conical antenna. The first and second conical antennas may extend in opposing directions and defining a biconical antenna when in the first and second deployed positions.

Deployable biconical radio frequency (RF) satellite antenna and related methods

A welding clamp uses opposing metal pieces to clamp two pieces of sheet metal together with a defined gap between panels for the purpose of welding, in this case, butt welding. The clamp has an integral copper backing plate to provide weld backing support and thermal dissipation to the metal for improved butt weld results. The integral copper backing plate adds stiffness to the adjoined panels while providing a solid non-weldable backing support to the panels being joined, reducing or eliminating weld blow-through.

Apparatus for securing sheet metal panels for butt-welding with integral copper backing plate

Sunglasses with integrated face shield

A multi-chip module has an integral capacitor element embedded within the substrate and comprises a plurality of substrate layers forming a multi-chip module substrate. The substrate has a cut edge and forms at the cut edge a bondable edge. A via is formed in the substrate, and a dielectric capacitive material fills the via for a plurality of substrate layers and defines a multilayer capacitor. The multilayer capacitor and via are positioned at the bondable edge and connects to the bondable edge. In one aspect, the via having the dielectric capacitive material is positioned at the cut edge, and includes a conductive material filling at least a portion of the cut via to form the bondable edge. The dielectric capacitive material and bondable edge form a junction surface. A signal trace can be formed on a substrate layer and connected to the capacitor to form a DC blocking capacitor structure. A ground line can be formed on one substrate layer and engage the capacitive material. A signal trace can be formed on one of the substrate layers and engage the bondable edge to define a decoupling capacitor structure.

Method of forming multi-chip module having an integral capacitor element

A phased array antenna includes an antenna housing including a subarray assembly and a plurality of beam forming network modules positioned on the subarea assembly. An antenna support and interconnect member are mounted on the antenna housing and include a carrier member having a front antenna mounting surface substantially orthogonal to the module support for supporting at least one antenna element. A rear surface has a receiving slot. At least one conductive via is associated with the receiving slot and positioned to extend through the carrier member to a circuit element, such as an antenna element, supported by the mounting surface. A launcher member is fitted into the receiving slot and has a module connecting end that extends rearward to a beam forming network. The launcher member includes conductive signal traces that extend along the launcher member from the conductive via to the module connecting end.

Phased array antenna with interconnect member for electrically connnecting orthogonally positioned elements used at millimeter wavelength frequencies

A multi-chip module has an integral capacitor element embedded within the substrate and includes a plurality of substrate layers forming a multi-chip module substrate. The substrate has a cut edge and forms at the cut edge a bondable edge. A via is formed in the substrate, and a dielectric capacitive material fills the via for a plurality of substrate layers and defines a multilayer capacitor. The multilayer capacitor and via are positioned at the bondable edge and connects to the bondable edge. In one aspect, the via having the dielectric capacitive material is positioned at the cut edge, and includes a conductive material filling at least a portion of the cut via to form the bondable edge. The dielectric capacitive material and bondable edge form a junction surface. A signal trace can be formed on a substrate layer and connected to the capacitor to form a DC blocking capacitor structure. A ground line can be formed on one substrate layer and engage the capacitive material. A signal trace can be formed on one of the substrate layers and engage the bondable edge to define a decoupling capacitor structure.

Multi-chip module having an integral capacitor element

A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, `tub`-like structure. The tub-like structure is comprised a laminated stack of thin layers of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die, that has been mounted at a floor portion of the tub, may be electrically connected to a plurality of conductive recesses or pockets located at top and bottom sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs.

Growing community of inventors

Melbourne, FL, United States of America

Edward G Palmer