Polytronics Technology Corporation

Edward Fu-Hua Chu

David Shau-Chew Wang

Yun-Ching Ma

Chih-Ming Yu

The over-current protection device of the present invention uses the unbalanced properties of the thermal expansion coefficients between the outer and inner sides for an upper metallic conductive sheet and a lower metallic conductive sheet to generate a torque to deform outwardly. The torque is used to pull a current-sensing element and present with at least a cracking face, so as to introduce an electrically open effect similar to a fuse. Thus, the present invention can achieve the object for preventing the danger of circuit system by the short circuit during the burning of over-current protection device.

Over-current protection device

The present invention discloses a manufacturing method of an over-current protection device, characterized in that the PTC plaque is conducted by punching under frozen state to form the over-current protection devices so as to reduce the heating and temperature rising in the PTC plaque due to punching and temperature difference between the metal foil and the conductive composite material. Relatively, the deformation and stress of the over-current protection device caused by punching will also be reduced. Therefore, there is no need for additional process to increase the temperature sensitivity and electrical property stability of the over-current protection device.

Manufacturing method of over-current protection devices

The present invention discloses an over-current protection apparatus for high voltage, which connects the ceramic current-sensing element and polymer current-sensing element in series to form a novel over-current protection apparatus. By the characteristic of the polymer current-sensing element having higher switching off speed, the invention first responds to the over-current by raising its temperature, and then the heat is thermally conducted through the adhesive layer to the ceramic current-sensing element, resulting in a voltage drop produced by the over-current partially or predominantly received by the ceramic current-sensing element. Thus, the over-current protection device of the invention not only can endure high voltage (&#x3e;600V), but also will not exhibit a negative temperature coefficient phenomenon.

Over-current protection apparatus for high voltage

An over-current protection device comprises a positive temperature coefficient material layer, an upper electrode foil, a lower electrode foil, a first metal terminal layer, a second metal terminal layer and at least one insulating layer. The upper electrode foil is disposed on the upper surface of the positive temperature coefficient material layer, and the lower electrode foil is disposed on the lower surface of the positive temperature coefficient material layer. The first metal terminal layer electrically connects the upper electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole, and the second metal terminal layer electrically connects the lower electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole. The insulating layer isolates the upper electrode foil from the second metal terminal layer and the lower electrode foil from the first metal terminal layer.

The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.

Surface mountable device

The present invention discloses an over-current protection apparatus, comprising a current-sensitive element, a first electrode and a second electrode. The over-current protection apparatus of the present invention is a three-dimensional multi-layer structure, and can be formed by heating, pressing, etching, cutting and multi-stage deformation to prevent it from breakage during the bending process. Therefore, the over-current protection apparatus with at least one bend is formed.

Over-current protection apparatus and method for making the same

The present invention relates to an over-current protecting apparatus, which comprises at least one PTC over-current protecting component and a body. The PTC over-current protecting component has a PTC material, electrodes covering the PTC material, and metal terminations electrically connected to the electrodes. The body has an insulating layer and a first conductive and second conductive regions covering the insulating layer. An end of the first conductive region and second conductive region are electrically connected to the metal terminations, and another ends of the first conductive and second conductive regions are mounted to a PCB. The metal material occupies over 20% area of the sidewall of the first conductive and second conductive regions for increasing solderability. Besides, the top of the PTC over-current protecting component can be adhered to another body to form a symmetrical bodies.

Surface mountable over-current protecting apparatus

A PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.

Growing community of inventors

Taipei, Taiwan

Edward Fu-Hua Chu