Raychem Limited

Other

Tyco Electronics Corporation

Edward F Chu

Vijay N Reddy

Daniel A Chandler

Robert P Saltman

Nelson H Thein

George B Park

James A Rinde

Stephen Michael Baigrie

Ann Banich

John G Lahlouh

Chi-Ming Chan

Susan Melsa Jordan

Steven T Lin

Soy Chu

Steven Sunshine

Robert Ives

Luis A Navarro

The NYTBridge allows a user to bridge the gap between data collected by hand-held scanning devices and conventional databases used in the field of inventory management without database or procedural programming knowledge on the part of the user. The NYTBridge does this by first allowing the user to access an existing database. The user may then select data fields, such as the location of an item in inventory, from the database without writing coded database queries. The NYTBridge then allows the user to download the selected data fields as a data set along with a scanner program that will read the created data set. Both the data set and the scanner program are either saved on a PCMCIA card to be used in a scanner, or downloaded directly into the hand held scanner via either serial port communication or communication dock tethering. When the scanner program is run on the scanner, the scanner program creates a scanner file for the collected, verified and/or corrected data. After the data is collected, verified and/or corrected, NYTBridge reads the scanner file from the hand held scanner and allows the user to update the relational database. The NYTBridge utilizes a graphical user interface and does not require low level programming by the user at any stage of the inventory management process.

Computer implemented program for inventory management

Processes and apparatus for melt extrusion of polymeric compositions, particularly conductive polymers, in which a gear pump delivers molten polymeric composition to an extrusion orifice. Overfeeding of the composition due to pressure variations is avoided by means of a polymer relief means, preferably a second, smaller gear pump, which removes a portion of the molten composition when the pressure exceeds a selected level.

Extrusion of polymers

An electrical device which includes a resistive element which exhibits PTC behavior, is composed of a conductive polymer composition, has a planar shape with first and second major surfaces, and has a thickness of at most 0.64 mm . The resistive element is sandwiched between first and second metal foil electrodes, at least one of which has a thickness of at least 0.055 mm, so that the ratio of the resistive element thickness to electrode thickness is 1:1 to 16:1. The device can be used as a circuit protection device in an electrical circuit.

Electrical device comprising a conductive polymer

A circuit protection device for protecting batteries is formed from a resistive element composed of a PTC conductive polymer composition and two electrodes. The device has a resistive element thickness of 0.025 to 0.20 mm; a crosslinking level equivalent to 1 to 20 Mrads; a surface area of at most 120 mm.sup.2 ; a resistance at 20.degree. C., R.sub.20, of at most 0.030 ohm; and a resistivity at 20.degree. C., .rho..sub.20, of at most 2.0 ohm-cm. Devices of the invention are sufficiently small to be easily inserted into an assembly comprising a battery, particularly a rechargeable battery, and the device. Such assemblies are used for powering portable electronic equipment such as cellular telephones.

Electrical device

A conductive polymer composition containing a particulate conductive filler dispersed in a polymeric component. The polymeric component comprises a first polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) is polyethylene, and a second polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) comprises units derived from a first monomer which is ethylene and a second monomer which is an alkyl acrylate having the formula --CH.sub.2 .dbd.CHCOOC.sub.m H.sub.2m+1 --, where m is at least 4. The resulting composition is useful in preparing electrical devices, e.g. circuit protection devices, which have lower resistivities, higher PTC anomalies, and better thermal and electrical stability than devices comprising conventional conductive polymer compositions.

Conductive polymer composition

A conductive polymer composition containing a particulate conductive filler dispersed in a polymeric component. The polymeric component comprises a first polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) is polyethylene, and a second polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) comprises units derived from a first monomer which is ethylene and a second monomer which is an alkyl acrylate having the formula --CH.sub.2 .dbd.CHCOOC.sub.m H.sub.2m+1, where m is at least 4. The resulting composition is useful in preparing electrical devices, e.g. circuit protection devices, which have lower resistivities, higher PTC anomalies, and better thermal and electrical stability than devices comprising conventional conductive polymer compositions.

Conductive polymer composition and device

A conductive polymer composition which has a resistivity of less than 10 ohm-cm and which exhibits PTC behavior comprises a polymeric component and a particulate conductive filler. The polymeric component comprises a first crystalline fluorinated polymer having a first melting point T.sub.m1 and a second crystalline fluorinated polymer having a second melting point T.sub.m2 which is from (T.sub.m1 +25).degree. C. to (T.sub.m1 +100).degree. C. The composition exhibits one of a number of characteristics, including a relatively high PTC anomaly. The composition is useful in circuit protection devices to be used at high ambient conditions.

Electrical device comprising a conductive polymer composition

A conductive polymer composition in which a particulate conductive filler is dispsered in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

A conductive polymer composition which has low resistivity and good electrical stability. In one aspect the composition comprises a nonconductive filler which is a dehydrated metal oxide. In another aspect the composition comprises a conductive filler which is metal particles in which the bulk density is less than 0.15 times the true density. Compositions of the invention are particularly useful for circuit protection devices.

A composition which contains 35 to 85% by weight of a copolymer of tetrafluoroethylene and hexafluoropropylene (FEP), 10 to 60% by weight of a copolymer of tetrafluoroethylene and perfluoropropylvinyl ether (PFA), and 5 to 60% by weight of melt-processable polytetrafluoroethylene (PTFE). The composition is particularly suitable for use as an insulating material on a substrate such as a resistive element in a conductive polymer heating cable. The composition has good physical properties, low creep, and low secondary crystallization, and exhibits little stress-cracking when exposed to elevated temperatures.

Fluoropolymer compositions

A conductive polymer composition in which a particulate conductive filler is dispersed in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

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Sunnyvale, CA, United States of America

Edward F Chu