Dell Products Inc.

III Holdings 2, LLC

Edward Davis Geist

Andrew Olen Ingalls

Qinghong He

David James Borland

Arnold Thomas Schnell

Daniel A Phipps

Matthew C Grossman

Antonio T Latto

Jing-Tang Wu

Nick Poteracki

Shu-Yu Jiang

Walter Denton Scott

Neda Abdul-Razzak

Rong Yu Wang

Jeffrey Carl Defilippi

Hsu-Min Jen

Stephan Leonidas Beatty

Tung Yi Chen

Joseph E Jasinki

A card connector corresponding to a first card type associated with a plurality of electrical contacts for receiving cards corresponding to various card types, each card type associated with a set of electrical contacts fewer than, more than or the same number of electrical contacts as the first card type. An elongated body may be formed with a closed end and an open end. A cap may be positioned on the open end to configure the card connector in a closed configuration to support cards of a card type associated with fewer or the same number of electrical contacts. The cap may be removed to configure the card connector in an open configuration to support cards associated with more electrical contacts. The cap may have PCB connectors for positioning the cap a distance from the elongated body to configure the card connector in an augmented open configuration.

Configurable electrical card connector for connecting to cards of different lengths

An information handling system storage bay accepts 2.5 inch and 3.5 inch storage drives held in a storage drive carrier sized to hold 3.5 inch storage drives and having an adapter that couples to the storage drive carrier to adapt it to hold 2.5 inch drives. The storage drive carrier is manufactured as a contiguous piece from a mold with hard plastic to integrate the adapter so that the adapter breaks free to couple to the storage drive carrier when a small size drive is to be held. Snaps in the contiguous piece couple with the adapter after the adapter is broken free to store the adapter when a larger sized drive is held by the storage drive carrier.

Information handling system storage drive carrier

Thermal coupling with between an electrical component, such as a CPU, and a heatsink can be provided by a movable heatsink insert separate from the heatsink. This movable heatsink insert can be placed on the electrical component. The heatsink can be thermally coupled to that additional thermal conductor. The heatsink, which is attached to the printed circuit board, is not in direct contact with the electrical component, reducing the likelihood that the heatsink could cause bending of the printed circuit board by pressing down on the electrical component. Further, a spring coupled between the heatsink and the movable heatsink insert can provide further pressure relief such that the heatsink assembly can be attached to an electrical component without applying excessive force to the electrical component.

Heatsink for information handling system

A data processing system includes an enclosure, one or more airflow manifold structures within the enclosure, and a plurality of data processor cards mounted within the enclosure. Each one of the one or more airflow manifold structures has an air inlet portion and an air outlet portion. Each one of the data processor cards extends substantially parallel to each other one of the data processor cards. Each one of the data processor cards includes an airflow duct having an air inlet portion thereof covering a portion of the air outlet portion of at least one of the one or more airflow manifold structures and includes a plurality of data processing units within the airflow duct.

Airflow ducting apparatus for data processing systems

A processor can be damaged by a heat sink. If the heat sink is improperly installed, the heat sink may damage the processor and/or the motherboard. Sequential tightening of mechanical fasteners is thus recommended, but the sequential tightening is challenging to implement. Sequential tightening of fasteners helps reduce damage to a processor. When a heat sink is fastened over the processor to a motherboard, mechanical fasteners are tightened in a sequence to reduce damage to the processor. To ensure sequential tightening of the mechanical fasteners, the heat sink is first secured with only two of the mechanical fasteners preinstalled in two of four holes in the heat sink and sequentially tightened into a bolster plate on a bottom side of the motherboard. A cover is then installed over the heat sink, and the cover has two mechanical fasteners that align with a remaining two of the four holes in the heat sink. A remaining two of the mechanical fasteners may then be sequentially tightened into the bolster plate.

Cover for heat sink

Information handling system housing

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Austin, TX, United States of America

Edward Davis Geist