Advanced Micro Devices Corporation

Other

Edward Christopher Stewart

Richard David Edwards

Jason Alan Grover

Scott Gregory Bushman

Susan Hickey

Curtis Warren Doss

Anthony John Toprac

Richard J Markle

Cabe W Nicksic

Timothy L Jackson

Florian A Walter

C Allen Stewart

Anastasia Lynn Oshelski Peterson

A method and an apparatus for routing a semiconductor wafer to at least one of a plurality of processing tools based upon tool performance. Data relating to a performance of a first processing tool and a performance of a second processing tool is acquired. A semiconductor wafer is routed to one of the first processing tool or the second processing tool based upon a comparison between the performance of the first processing tool and the performance of the second processing tool using a controller.

Dynamic tool scheduling based upon defects

A method, apparatus and a system, for provided for performing an automated process flow adjustment. A semiconductor wafer is processed based upon a routing plan and a predetermined schedule. A fault detection relating to the processing of the semiconductor wafer is performed. Dynamically modifying the predetermined routing plan or the predetermined schedule based upon the fault detection. A predetermined process material delivery plan is dynamically modified based upon the modifying of the routing plan or modifying of the predetermined schedule.

Method and apparatus for impasse detection and resolution

A method and an apparatus for sorting between actual and perceived errors related to processing of semiconductor wafers. A plurality of semiconductor wafers are processed. Fault data relating to the processed semiconductor wafers is acquired. A trend associated with the fault data is determined. A determination is made whether the fault data relates to an actual fault associated with the semiconductor wafers or to a calibration error, based upon the trend. A component is notified of the calibration error in response to the determination that the fault data relates to the calibration error.

Dynamic maintenance of manufacturing system components

A method and system are provided for analyzing error signals based on fault detection. The method comprises detecting a fault associated with a processing of a workpiece in a manufacturing system having a plurality of processing tools, identifying at least one of the processing tools that processes the workpiece, and providing an error signal to the at least one of the identified processing tools to perform diagnostics based on the detected fault.

Analyzing error signals based on fault detection

A method includes identifying a degraded condition associated with the processing of a workpiece. At least one process tool associated with the degraded condition is identified. Trace data collection is enabled for the identified process tool. A system includes a processing system configured to process a workpiece and a tool monitor. The tool monitor is configured to identify a degraded condition associated with the processing of the workpiece, identify at least one process tool from the processing system associated with the degraded condition, and enable trace data collection for the identified process tool.

Method and apparatus for dynamically enabling trace data collection

A method for measuring defects includes receiving a defect characteristic measurement for each measurement site in a first subset of a plurality of measurement sites on a workpiece. A second subset of the plurality of measurement sites is defined. The size of the second subset is based on the defect characteristic measurements of the first subset of the plurality of measurement sites. A metrology tool is directed to measure the defect characteristic at each of the measurement site in the second subset responsive to the size of the second subset being greater than zero. A system includes a metrology tool and a controller. The metrology tool is configured to measure a defect characteristic at each of a first plurality of measurement sites on a workpiece. The controller is configured to compare the measured defect characteristics at the first plurality of measurement sites against a first predetermined threshold and direct the metrology tool to measure the defect characteristic at each of a second plurality of measurement sites on the workpiece responsive to the measured defect characteristics being greater than the first predetermined threshold.

Method and apparatus for measuring defects

In one illustrative embodiment, a method is provided that controls a stepper to position a focal plane of a light source adjacent a top surface of a layer of photoresist. A metrology tool is used to measure a thickness of the layer of photoresist, and a controller uses the thickness measurement to determine a position of the top surface of the layer of photoresist. The controller delivers a control signal to the stepper, causing the stepper to move the focal plane of the light source adjacent the top surface of the layer of photoresist.

Method and apparatus for controlling focus based on a thickness of a layer of photoresist

A method for detecting faults in a manufacturing line includes processing a plurality of workpieces in a plurality of tools; generating a first error signal associated with the workpieces based on the processing performed in a first tool of the plurality of tools; generating a second error signal associated with the workpieces based on the processing performed in a second tool of the plurality of tools; combining the first and second error signals to generate a composite error signal; and identifying a fault condition with the workpieces based on the composite error signal. A manufacturing system includes a plurality of tools adapted to process workpieces, and a fault monitor. The fault monitor is adapted to receive a first error signal associated with the workpieces based on the processing performed in a first tool of the plurality of tools, receive a second error signal associated with the workpieces based on the processing performed in a second tool of the plurality of tools, combine the first and second error signals to generate a composite error signal, and identify a fault condition with the workpieces based on the composite error signal.

Method and apparatus for fault detection using multiple tool error signals

In one illustrative embodiment, a system is provided for controlling a lens of an optical system of a stepper. The system comprises the stepper, the optical system, and a controller. The stepper has a light source controllably energizable to provide light to a surface of a semiconductor device. The lens of the optical system has a controllable focus. The controller is capable of determining a temperature of the lens, and controllably varying the focus of the lens in response to the temperature of the lens.

Method and apparatus for controlling optical-parameters in a stepper

A method for detecting a degraded light source is provided. An exposure time associated with the light source is monitored. The exposure time is compared to at least one control limit. A degraded condition is identified based on the exposure time violating the control limit. A processing tool includes a stepper and an automatic process controller. The stepper has a light source and is adapted to illuminate a wafer for an exposure time. The automatic process controller is adapted to monitor the exposure time, compare the exposure time to at least one control limit, and identify a degraded condition based on the exposure time violating the control limit.

Stepper with exposure time monitor

A high density linear storage system comprising at least one storage unit mounted to a base frame assembly. The at least one storage unit may include a plurality of shelves or storage compartments for storing files, books, computer printouts and the like. A handle is mounted on an end of the at least one storage unit to facilitate the extension and retraction of the unit. The base frame assembly includes a stationary base frame and a movable carriage. The carriage further comprises a primary frame and an intermediate frame, which telescopically nest within the base frame when in a fully retracted position. Rollers are attached to the frame members of the intermediate frame and are configured to slidably engage channel members of the base frame and the primary frame. Retaining clips are provided to prevent extension of the primary and intermediate frames beyond a predetermined distance. A locking mechanism prevents the extension of more than one storage unit at a time. A drive system may be provided to assist in the extension and retraction of storage units.

High density linear motion storage system

Shelving apparatus includes a pair of spaced-apart support posts, each post having two back-to-back plates of different widths cooperating to define a recess for receiving therein one end of an associated closure panel extending between the posts, two longitudinally extending parallel rows of openings in the plates, corresponding openings in the two rows being aligned transversely of the plates, first and second shelf clips respectively disposed on opposite sides of each post in horizontal alignment with each other, each clip having a hook-shaped finger extending therefrom adjacent to one side edge thereof and an aperture therethrough adjacent to the other side edge thereof, the clip being disposed in use with the finger extending through a selected opening in one of the rows for latching engagement with the associated post and with the aperture disposed in registry with the transversely aligned opening in the other row of openings, the apertures being dimensioned and arranged freely to accommodate the attachment finger of the clip mounted on the opposite side of the post for permitting clips on the opposite sides of the post to be mounted and demounted independently of each other, and a shelf having a marginal flange disposed between the mounting clips and the support posts for mounting the shelf thereon.

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Buda, TX, United States of America

Edward Christopher Stewart