Caterpillar Inc.

Edward Choi

Chris J Scolton

Jacob Carl Wyss

John Walter Winkler

This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

Heat management and removal assemblies for semiconductor devices

A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.

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Edwards, IL, United States of America

Edward Choi