Stryker Corporation

Edward Chia-Ning Tang

John J Janik

Robert A Brindley

James Bernard Dunlop

Leland Joseph Spangler

Rob Brindley

Joseph Leland Spangler

Rakesh Babu Katragadda

Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction are selectively applied to the coupon to ensure that it has a consistent height across its exposed surface. Once the polymer coupon is bonded the components forming the medical device are attached to the coupon and the coupon is shaped to form the individual medical devices. Shaped sections of the coupon are then lifted off the rigid backing. The lifted off sections on which the components were attached are the medical devices.

Method of fabricating implantable medical devices from a polymer coupon that is bonded to a rigid substrate

An implantable electrode array is provided that includes a carrier that is flexible. At least one control module is coupled to the carrier. A shell encases the control module. At least one electrode is coupled to the carrier and is electrically connected to the control module.

Implantable electrode array assembly including a carrier with packaged control modules

An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

Implantable electrode array assembly with an array substrate, electrodes and packaged integrated circuits

Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates

A method of forming an implantable electrode array that includes one or more packaged control modules. A control module is packaged by mounting the module to a substrate and forming a containment ring around the module. A conformal coating is disposed over the surface of the module to cover the carrier. Within the containment ring, the conformal coating hardens to form a non-porous shell around the control module. The one or more packaged control modules are placed in a flexible array. Electrodes that are mounted to or embedded in the flexible carrier are connected to the one or more control modules.

Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates

An implantable electrode array that includes a carrier on which multiple spaced apart electrodes are disposed. Embedded in the module are control modules. The control modules are contained in packages. Portions of the packages extend outwardly from the carrier so as to be disposed against adjacent surfaces of the carrier. The packages contain conductive tracts that provide conductive links from the conductors internal to the carrier to the packaged control modules.

Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier

Method of fabricating implantable medical devices from a polymer coupon that is bonded to rigid substrate

An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached.

Method of fabricating an implantable medical device that includes one or more thin film polymer support layers

An implantable electrode array that includes multiple spaced apart electrodes to which current can be individually sourced and sunk. The array includes a carrier that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in recesses within the carrier. A sheet of material more flexible than the carrier is disposed between, on one side, the carrier and the control modules and, on the other side, the electrodes. Conductors over which instructions and power are applied to the control modules and conductors that extend between the control modules are the electrodes are embedded in and extend through the sheet of flexible material.

Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier

An implantable electrode array () that includes multiple spaced apart electrodes () to which current can be individually sourced and sunk. The array includes a carrier () that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows () within the carrier.

Growing community of inventors

Ann Arbor, MI, United States of America

Edward Chia-Ning Tang