Eastman-kodak Company

Edward Carnall, Jr

Edward J Ozimek

Jose M Mir

Steven A Ferranti

David N Bull

Robert Leroy Nielsen

Armin K Weiss

Terry Tarn

Laurie A Strom

Lauri A Strom

A hermetically sealed package for a microelectronic device, such as a solid-state image sensor, includes a ceramic housing defining a cavity in a major surface thereof and metal terminals extending through side edges thereof to the cavity. A microelectronic device is in the cavity and electrically connected to the terminals. A cover plate extends over the cavity and over a portion of the major surface around the cavity. An amalgam of a mixture of a liquid metal and a powdered metal is between the cover plate and the housing surface. The amalgam bonds the cover plate to the housing and forms a hermetical seal therebetween.

Hermetically sealed microelectronic package

A method and apparatus for forming a solid preform body of an amalgam from a thin layer of the amalgam comprises a base plate on which the amalgam in liquid form is spread into a thin layer. The amalgam comprises a mixture of a liquid metal and a powdered metal. A first temperature is applied to the amalgam layer through the base plate. The first temperature may be lower than the melting temperature of the liquid metal in the amalgam to form a frozen solid layer of the amalgam, or may be above the melting temperature of the liquid metal to maintain the amalgam layer in liquid form. A second temperature is applied to a portion of the amalgam layer which is to form the preform body. If the first temperature is below the melting temperature of the liquid metal, the second temperature is above the melting temperature of the liquid metal to form a molten zone in the amalgam layer along the edge of the preform body so as to permit the body to be separated from the remaining portion of the amalgam layer. If the first temperature is above the melting temperature of the liquid metal, the second temperature is below the melting temperature so as to form a frozen solid portion in the amalgam layer which can be removed from the amalgam layer.

Method and apparatus for forming amalgam preform

A process of forming on a substrate a coating of a precursor of a crystalline rare earth alkaline earth copper oxide or heavy pnictide mixed alkaline earth copper oxide electrical conductor and converting the precursor to the crystalline electrical conductor. The coating precursor is provided by (a) preparing a solution comprised of a volatilizable solvent and, as a solute, metal-ligand compounds of each of the metals forming the crystalline electrical conductor, the proportions of the solute metals corresponding to those present in the precursor coating and the ligands being inorganic ligands chosen to be volatilizable on heating, (b) spraying the aqueous solution to form discrete liquid particles each containing the metals as metal-ligand compounds in proportions corresponding to those present in the precursor coating, (c) evaporating at least a portion of the volatilizable solvent fronm the liquid particles to form solid particles each containing the metals as metal-ligand compounds in proportions corresponding to those present in the precursor coating. The solid particles can be formulated as a screen printing composition to facilitate coating on the substrate.

Process for preparing superconductive thick films

Method and apparatus are disclosed for mounting a second optical component on a first optical component using a spacer layer for forming a controlled gap between the two components. In a preferred embodiment, a CCD sensor is formed having a non-active area and an active area for detecting lightwaves. A spacer layer of an epoxy or similar material is formed on at least a portion of the non-active area of the sensor. A fiber optic faceplate is mounted on the spacer layer to form the controlled gap between the active area of the CCD sensor and the faceplate. The fiber optic faceplate has a predetermined index of refraction for passing lightwaves towards the active area of the sensor. A coupling compound, having an index of refraction which substantially matches that of the faceplate, is used to fill the controlled gap between the faceplate and the active area of the sensor.

Fiber optic faceplates and method of mounting same

A modular image sensor array is disclosed which includes a plurality of tiles each of which has an image sensor mounted thereon. The tiles are mounted on a base plate such that the image sensors form a predetermined pattern. In order to precisely locate the tiles relative to each other and to provide for the replacement of defective tiles, the tiles are assembled in an interlocking pattern on the base plate. The top surface of the tiles is formed by ceramic plates, and electrical conductors for the image sensors are formed on one of the ceramic plates. A transparent cover is mounted over all of the image sensors in the array.

Modular image sensor array

The present invention relates to a preform of a solid body of an amalgam. The amalgam is a mixture of a metal which is liquid at room temperature and at least one powdered metal. The preform is formed by mixing together the ingredients of the amalgam and pouring the amalgam into a caity in a mold. The mold and amalgam is then cooled to a temperature below the melting temperature of the liquid metal in the amalgam. The preform is then removed from the mold. The preform can be stored at the low temperature until it is desired to use it to bond two bodies together. The preform can be used to bond two bodies together, such as the cover plate and housing of a microelectronic device package, by placing the preform between the two bodies. The bodies are mechanically scrubbed and clamped together with the preform therebetween and heated to a temperature at which the preform melts and the amalgam reacts to bond to the two bodies. Since the liquid metal in the amalgam has a melting temperature slightly above normal room temperature, the bonding can be achieved at relatively low temperatures.

Amalgam preform, method of forming the preform and method of bonding

Thick film circuit elements are disclosed comprised of an insulative substrate selected from the group consisting of strontium titanate, magnesia, alumina, and aluminum nitride, and providing a conductive path between at least two locations on the substrate, a crystalline rare earth alkaline earth copper oxide layer exhibiting a superconducting onset transition temperature in excess of 77.degree. C. comprised on an R.sub.1 A.sub.2 C.sub.3 crystalline phase.

Crystalline rare earth alkaline earth copper oxide thick film circuit

A method of making a hermetic seal for a solid-state device is disclosed. The device includes a ceramic housing having a cavity for an element such as an image sensor. A cover formed of a transparent material is sealed to the housing to close the cavity. A metallization support is formed on the cover and on the housing. In order to form a hermetic seal at a relative low temperature, a layer of indium is coated on the metallization support of either the cover or the housing, and a layer of tin is coated on the support of the other of the two parts. The cover is then placed on the housing, and the parts are placed in a furnace where a temperature under the melting temperature of the composite alloy of tin and indium is maintained for a period long enough to diffuse the tin and indium together. The temperature is then raised to a temperature sufficient to melt the alloy, and the device is then slowly cooled to ambient temperature.

Method of making a hermetic seal in a solid-state device

Highly densified, polycrystalline photoconductors can be produced by hot-pressing various materials, such as powdered lead monoxide. The powdered material is subjected to a temperature and pressure for a length of time sufficient to form a photoconductive element having a density of at least 85% and up to and including the theoretical density of the material. Such formed photoconductive element or material can be utilized in electro-photographic applications and, with the exception of such material in its single crystal form, will exhibit increased absorption of activating radiation, increased signal-to-noise ratios, and improved spatial frequency response in comparison with presently known photoconductive elements or materials.

Growing community of inventors

Rochester, NY, United States of America

Edward Carnall, Jr