Cisco Technology, Inc.

Dynapar Corporation

Edward C Kuhar

Stephen V Saliga

Thomas Goss Lutman

Erin Patrick McGough

A fabrication method of a dual-band antenna array. The dual-band antenna array may comprise a trace split, a first frequency branch, and a second frequency branch. The trace split may feed the first frequency branch and the second frequency branch. The first frequency branch may comprise a first frequency branch geometry that may cause a majority of a current of a signal fed into the trace split to feed the second frequency branch when the signal comprises a second frequency. The second frequency branch may comprise a second frequency branch geometry that may cause the majority of the current of the signal fed into the trace split to feed the first frequency branch when the signal comprises a first frequency.

Method of making a dual-band yagi-uda antenna array

A dual-band antenna array may be provided. The dual-band antenna array may comprise a trace split, a first frequency branch, and a second frequency branch. The trace split may feed the first frequency branch and the second frequency branch. The first frequency branch may comprise a first frequency branch geometry that may cause a majority of a current of a signal fed into the trace split to feed the second frequency branch when the signal comprises a second frequency. The second frequency branch may comprise a second frequency branch geometry that may cause the majority of the current of the signal fed into the trace split to feed the first frequency branch when the signal comprises a first frequency.

Dual-band yagi-uda antenna array

In one embodiment, an apparatus includes a housing with a conductive surface. A circuit board may be positioned within the housing. The circuit board includes a deflectable portion that may be movable relative to the housing. A conductive pad is positioned on the deflectable portion of the circuit board. A spring member is positioned between the housing and the circuit board. The spring member may be movable between a first configuration and a second configuration. The conductive pad of the circuit board may be spaced away from the conductive surface of the housing by the spring member in the first configuration and in contact with the conductive surface of the housing with the spring member in the second configuration.

System for interconnecting electrical components

A mounting apparatus for mounting optics of a light curtain. The apparatus includes a light curtain optics housing and a mounting bracket. The housing includes a curved mounting surface that extends along a portion of a length of the housing. The mounting bracket is connected to the curved mounting surface such that the mounting bracket can be longitudinally adjusted with respect to the optics housing. The mounting bracket includes a curved surface and an adjustment slot that allow for rotational adjustment with respect to the mounting bracket.

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Concord, OH, United States of America

Edward C Kuhar