Endgate LLC

Endwave Corporation

Xtremelux Corporation

Other

Microwave Technology, Inc.

Pacific Monolithics

Edward Bryant Stoneham

Clifford A Mohwinkel

Edwin F Johnson

Thomas M Gaudette

Masahiro Omori

Allen F Podell

Mark V Faulkner

Mark J Vaughan

Arthur D Herbig

Chiamin Cheng

Richard Tamler

A heat-sink assembly is configured with two parts to grip a light-emitting element and produce a transverse force urging a surface of the light-emitting element toward a surface of the heat-sink assembly, which conducts heat away from the light-emitting element. Fastening mechanisms and a fulcrum inter-connect the heat-sink parts and produce the force that grips the light-emitting element. A configuration of the heat-sink parts creates a semi-enclosed space accessible through a gap. A configuration of elastomeric gaskets within the semi-enclosed space protects a portion of the space from intrusion of liquids or other environmental influences. Configuration of the heat-sink parts to form a recess in the heat-sink assembly provides protection of the light-emitting element from mechanical damage, and the recess may contain transparent materials that further protect the light-emitting element from detrimental environmental influences.

Compressive heat sink

A light projector assembly for irradiating the interior of a bin when the bin is in a predetermined position, the bin having walls and a ceiling. A bin interior may include a plant-growing zone proximate a bottom of the bin. The walls may include one or more light-transmissive windows above the plant-growing zone. The light projector assembly may comprise a light projector and a support structure. A light projector may be supported outside of the bin position and proximate to and spaced from one of the one or more windows when the bin assembly is in the predetermined position. The light projector may be configured to project light upwardly through the one window and toward the ceiling. A support structure may support the light projector. The support structure may be spaced from a vertical extension of the predetermined position, unobstructive of vertical access to the bin.

Apparatus, systems, and methods for laterally sourced lighting

A digital-unit interface comprises a first node, a second node, a third node, and an amplifier assembly. The first node is connected to a pull-up resistor and is configured to be connected to the signal line of a transmission line connected to a first digital unit at a distal point. The second node is configured to be connected to a second reference electrical potential, a signal-return line of the transmission line, and a signal-return line of a second digital unit. The third node is configured to be connected to a signal line of the second digital unit. The amplifier assembly is configured to be connected between the first node and the third node and to transform between high electrical potentials on the first node and lower electrical potentials on the third node while the second digital unit communicates with the first digital unit.

Digital-unit interface

A rectangular pulse generator system is operatively configured to generate a generator output signal, the generator output signal formed as a base rectangular waveform gated by a modulating rectangular waveform, the base rectangular waveform having a first frequency and the modulating rectangular waveform having a second frequency less than the first frequency. A low-pass filter coupled to the rectangular pulse generator system is configured to receive a filter input signal representative of the generator output signal and to produce a filter output signal representative of the filter input signal. A voltage-controlled current source coupled to the low-pass filter generates a drive signal conducted by at least one LED producing a light flux determined by the current level of the LED drive signal. Methods are devised for calibration and for setting the average light flux level.

Apparatus and methods for controlling LED light flux

A lamp assembly () may include a circuit board (), one or more light-emitting devices () disposed on the circuit board (), a heat sink () in thermal contact with a surface of the circuit board (), a gasket () with a first surface in mechanical contact with the circuit board (), a bezel () a surface () of which is in mechanical contact with a second surface of the gasket (), and one or more fasteners () that may apply a force between the bezel () and the heat sink (). A lamp array () may include two or more lamp assemblies (), not all of which supply illumination with the same spectral characteristic, and a bearing mount () that may support each lamp assembly () and allow each to be oriented rotationally. A supply circuit () may include a nonlinear resistive element ().

Versatile sealed LED lamp

A lamp assembly () may include a linear light-emitting array () and a reflecting surface () arranged to limit the angular distribution of direct light while supplementing with reflected light the intensity of the direct light on a flat surface () of an object being illuminated. The reflecting surface () may be shaped to cause the distribution of the total illumination over the illuminated portion of the flat surface () to be uniform or to be linearly tapered or to have another desired profile. The reflecting surface () may be part of a heat-sinking reflector () that may include a mounting surface (), a blind (), oblong mounting holes () allowing rotational adjustment, heat sink mounting holes (), and/or one or more exit holes (), and that may have end pieces () attached to it.

Linear wash lamp

A cover assembly may be mounted on a substrate. The cover assembly may have an interior surface spaced from the substrate and may bound a hollow chamber over a circuit assembly. The hollow chamber may be filled with a fluid, such as a gas or a liquid. The cover assembly may also have an edge extending along the substrate around the circuit assembly and may include a dielectric cover, an electromagnetic shield, a conductive assembly, a resistive layer, and an aperture with a gas-permeable membrane. The electromagnetic shield. The dielectric cover may substantially enclose the hollow chamber bounded by the cover assembly. The electromagnetic shield may be attached to the dielectric cover and also substantially enclose the hollow chamber. The conductive assembly may extend along and may be electrically isolated from the electromagnetic shield. The conductive assembly may be conductively coupled to the circuit assembly.

Circuit structure with multifunction circuit cover

A multiplexer circuit may include a first-frequency-quarter-wavelength transmission line extending between a junction between a common terminal and a second-frequency terminal, and a first-frequency low-impedance circuit electrically directly connecting the first transmission line to a circuit ground. In some examples, a second-frequency-quarter-wavelength transmission line may extend between the first transmission line and a third-frequency terminal. A second-frequency low-impedance circuit may electrically directly connect the second transmission line to the circuit ground. The first and second transmission lines and the first and second low-impedance circuits may provide a third-frequency transmission line. A further second-frequency low-impedance circuit may electrically couple the second terminal to the first transmission line. A third-frequency low-impedance circuit may electrically couple the second terminal to the circuit ground. The first-frequency, further second-frequency, and third-frequency low-impedance circuits and the first transmission line may provide in combination a second-frequency transmission line.

Merged-filter multiplexer

A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the trench, and optionally, may divide the trench into sections. A conductive adhesive layer may be applied to the substrate face and, if included, the bridge. One or more circuit chips may be mounted on the adhesive layer, with at least one edge of one circuit chip adjacent to the trench. Alternatively or additionally, an adhesive layer may be applied to a base of a chip and then mounted to the substrate face, in like fashion. The trench may accommodate excess adhesive flowing out from under the one or more chips, while the bridge retains the adhesive across the width of the trench. If the adhesive is conductive, this provides continuity of the conductive layer on the face of the substrate across the trench. In one example, pairs of circuit chips may be effectively mounted in adjacent relationship for interconnection without interference from excess adhesive.

Chip mounting with flowable layer

An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive layers may be disposed on respective portions of the first and second surfaces. A first conductor, having an end, may be disposed on a surface of the first dielectric layer, including at least a first portion extending around at least a portion of the conductor end. The second conductive layer may line the channel extending around a portion of the conductor end. Some examples may include a stripline having a second conductor connected to the first conductor. Some examples may include a cover having a wall positioned on the first dielectric over the second conductor.

Component interconnect with substrate shielding

Chip-to-chip trench circuit structure

A method and apparatus for coupling a conductor-based transmission line, such as a strip transmission line, to a waveguide. The transmission line may be separated from a corresponding conducting ground plane by a first dielectric substrate layer. The ground plane may be adhesively coupled to a portion of the waveguide, and may be offset from the interior of the waveguide, so that adhesive squeezed out between the ground plane and the waveguide may be at least partially shielded from the waveguide, and thus does not significantly perturb electromagnetic signals within the waveguide.

Multi-substrate microstrip to waveguide transition

A coupler may include four ports, and first and second sets of conductive strips. Each set of conductive strips may include a plurality of interconnected conductive strips connected between two ports. Each conductive strip of the first set may be electromagnetically coupled to a conductive strip of the second set. Conductive tabs capacitively coupled directly or indirectly to the ground conductor may extend from conductive strips of the first and second sets. An interconnection may be positioned between adjacent tabs, the interconnection connecting conductive strips of one of the sets of conductive strips. The adjacent tabs may be spaced different distances from the interconnection.

Compensated interdigitated coupler

Two or three conductor coplanar transmission lines and lossy coplanar resistive films are formed on a surface of a substrate. The resistive film dimensions and resistivity are selected to suppress various spurious electromagnetic modes within and around the substrate. The resistive films may be positioned along the outer edges of the transmission lines or between the transmission line conductors. The resistive film may have regular spaced openings for producing an average resistivity different than that of a continuous resistive film. In one embodiment, a signal conductor has a serpentine shape and resistive film elements are positioned between adjacent sections of the signal conductor. In another embodiment, interdigitated resistive film elements extend between transmission line conductors.

Coplanar microwave circuit having suppression of undesired modes

First and second slotlines are mounted on an electrically insulating substrate having a planar face with a connection region. Each slotline has first and second, spaced-apart coplanar conductors that extend into the connection region. A fifth, ground conductor, also mounted on the substrate face, is spaced from and coplanar with the first and second slotlines and has a proximal portion in the connection region. A chip circuit includes first and second field-effect transistors (FETs) flip mounted in the connection region to all five conductors. The gates of the FETs are connected to the first slotline for receiving an input signal. The drains are connected to the second slotline for outputting the signal amplified by the transistors. The sources of the FETs are connected to the fifth conductor. This general configuration can be modified for use as an amplifier, oscillator, frequency multiplier or mixer. The slotline may divide into parallel slotline portions for providing plural circuits in parallel with distributed impedance matching. A slotline may loop back from the connection region to provide a choice for impedance matching, and a portion of the fifth conductor may extend between slotline conductors to provide capacitive coupling.

Growing community of inventors

Los Altos, CA, United States of America

Edward Bryant Stoneham