Other

Navini Networks, Inc.

Gridview Optical Solutions, Llc.

Cisco Technology, Inc.

Edward B Condon

Philip B Davis

Grant E Kenworthy

John Grabner

Stephen Michael Prince

Richard L Smith

A stress control apparatus for managing effects caused by electrical stress in a high voltage environment, and methods of manufacturing the apparatus. A dielectric tube with a central bore coated with a conductive material has an outer conductive coating on a lower section that is grounded. The central bore carries a high voltage potential from a current-carrying conductor. The grounded coating transitions to the exposed outer dielectric surface along a gradually tapered transition. A conductive insert connects to the central bore and forms an electric field in a space between the insert and the grounded coating. When coated with an epoxy and inserted into the central bore, the insert forms a small gap between an outer surface of the insert and part of the central bore, such that there is no zero potential difference in the gap. Any epoxy that oozes out during insertion will collect in the gap.

Stress control assembly and methods of making the same

Structure is provided for controlling the electrical stress on one or more optical fibers in a high voltage environment.

Stress control structure for optical fibers in a high voltage environment

A system and method improves linearly-polarized microstrip patch antenna performance and fabrication through the incorporation of a pin fin ground plane and an integral antenna feed assembly. In one embodiment, a patch antenna system includes an antenna area with a patch antenna that provides radio communications. A heat dissipation member is coupled to the antenna area and includes a plurality of pins that provide for both the dissipation of heat from the antenna area and a ground plane for the antenna area. An antenna feed line is further coupled with the antenna patch for providing an electrical connection from the antenna patch to other electronic circuitries, such as a wireless device that may be mechanically coupled to the heat dissipation member. Heat generated during the operation of the wireless device is directed to ambient air by way of the heat dissipation member.

Pin fin ground plane for a patch antenna

Growing community of inventors

Murphy, TX, United States of America

Edward B Condon