Solid State Devices, Inc.

Other

Edward B Applebaum

John M White

Mark D Adams

Haodong Li

Ralph Froman Alderson

Yuling Li

David M Parmelee

Solange Hanschke Lima

A radiation shielded semiconductor package for use in any variety of industries and applications is disclosed. In one embodiment, a radiation shielded semiconductor package comprises a radiation shielding base, one or more non-shielding sidewalls coupled to the shielding base, one or more radiation shielding flanges coupled to the sidewall, and one or more non-shielding coupling flanges coupled to the shielding flange. The base, the non-shielding sidewall, the shielding flange, and the non-shielding coupling flange define a device cavity, and at least one semiconductor device is positioned within the device cavity. A radiation shielding lid is coupled to the coupling flange and hermetically seals the semiconductor device within the device cavity. The shielding lid comprises shielding lid body and a non-shielding lid flange coupled to the lid body and is configured to couple to the coupling flange.

Radiation shielded semiconductor package

Human chemokine polypeptides and DNA/(RNA) encoding such chemokine polypeptides and a procedure for producing such polypeptides by recombinant techniques is disclosed. Also disclosed are methods for utilizing such chemokine polypeptides for the treatment of leukemia, tumors, chronic infections, autoimmune disease, fibrotic disorders, wound healing and psoriasis. Antagonists against such chemokine polypeptides and their use as a therapeutic to treat rheumatoid arthritis, autoimmune and chronic inflammatory and infective diseases, allergic reactions, prostaglandin-independent fever and bone marrow failure are also disclosed.

Human chemokines, CK&bgr;4 and CK&bgr;10/MCP-4

A hermetically sealed surface mount diode package composed of: a support member of electrically conductive material; a diode element having two mutually opposed surfaces constituting, respectively, cathode and anode contact surfaces, the element resting on the support member so that one of the surfaces is in contact with the support member; an electrical contact member for conductively contacting the other one of the surfaces of the diode member, the contact member having a frame portion which surrounds the diode and a connection portion enclosed by the frame portion and conductively connected to the other one of the surfaces; a frame member of electrical insulating material surrounding the diode and interposed between, and secured to, the support member and the frame portion to form a hermetic seal with the support member and the frame portion; and a cover plate of electrically conductive material disposed on, secured to, and forming a hermetic seal with, the frame portion, wherein the support member, the frame portion, the frame member and the cover plate form a hermetically sealed space enclosing the diode.

Hermetically sealed surface mount diode package

Growing community of inventors

La Habra Heights, CA, United States of America

Edward B Applebaum