Jds Uniphase Corporation

Memscap S.a.

Mcnc

Cronos Integrated Microsystems, Inc.

Edward Arthur Hill

Vijayakumar Rudrappa Dhuler

Ramaswamy Mahadevan

Robert Lavin Wood

Allen Bruce Cowen

Mark David Walters

David Alan Koester

Vivek Agrawal

Methods of forming optoelectronic devices include forming an electrically conductive layer on a first surface of a substrate and forming a mirror backing layer from the electrically conductive layer by forming an endless groove that extends through the electrically conductive layer. A step is then performed to remove a portion of the substrate at a second surface thereof, which extends opposite the first surface. This step exposes a front surface of the mirror backing layer. An optically reflective mirror surface is then formed on the front surface of the mirror backing layer.

Methods of forming integrated optoelectronic devices

A micro-electro-mechanical device designed such that the actuating means are only mechanically coupled to the optical components. The device includes a substrate, a mirror supported above the substrate, and a rotatory actuator also supported above the substrate. The mirror and actuator are mechanically coupled via a torsional coupling hinge such that the mirror can be angled and/or tilted by electrostatically driving the rotatory actuator. Advantageously, the micro-mirrors and actuator are fabricated from the same layer during the micro-machining fabrication process. In one embodiment, the mirror is rotatable about a fixed rotation axis. In another embodiment, the mirror is freely rotatable.

Articulated MEMS electrostatic rotary actuator

A movable microelectromechanical mirror structure for a microelectromechanical structure (MEMS) has an actuator (electrodes) for the moving mirror. The electrodes are situated at a predetermined angle to the horizontal thus improving the relationship between force applied on the mirror and the gap between the mirror and the electrodes. The angular electrode placement is achieved by the provision of a deformable electrode support member mounted on the substrate, with at least one of the electrodes mounted on the electrode support member, and a deforming element mounted against the deformable electrode support member such as to permanently maintain the deformable electrode support member in a deformed state.

MEMS electrostatic actuators with reduced actuation voltage

MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. In an alternative embodiment wherein the active microactuator is suspended within a frame above the substrate, the MEMS structure holds at least a portion of the active microactuator in a fixed position relative to the substrate over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. By actively altering the temperature of the active microactuator, the active microactuator can be controllably moved relative to the temperature compensation microactuator and/or the underlying substrate. Related methods of compensating for the effects of ambient temperature variations are provided. Further, an overplating technique is provided for precisely sizing a gap defined within a MEMS structure.

Methods of overplating surfaces of microelectromechanical structure

Add-drop optical switches include fixed reflectors, such as fixed mirrors, and movable reflectors, such as movable mirrors, wherein none of the fixed reflectors and none of the movable reflectors are oriented orthogonal to one another on a substrate when the movable reflectors that provide the add-drop functionality are in a radiation reflecting position. In preferred embodiments, each of the fixed and movable reflectors is oriented parallel to or at a 70&deg; angle to, the remaining fixed and movable reflectors when the movable reflectors are in the radiation reflecting position. Most preferably, the fixed reflectors and the movable reflectors all are oriented on the substrate in parallel when the movable reflectors are in the radiation reflecting position. By providing these orientations of fixed and movable reflectors, add-drop optical switches may be fabricated on silicon substrates using wet etching along crystallographic planes. High performance add-drop optical switches thereby may be provided.

Add-drop optical switches including parallel fixed and movable reflectors and methods of fabricating same

Integrated optoelectronic devices include a substrate having an opening therein that extends at least partially therethrough and a ledge extending inwardly from a sidewall of the opening. A pop-up mirror is provided in the opening. The mirror has an underside edge that is supported by an upward facing portion of the ledge when the mirror is in a closed position. A hinge is also provided. The hinge mechanically couples the mirror to the substrate so that the mirror can be rotated from the closed position to an open position.

Integrated optoelectronic devices having pop-up mirrors therein and methods of forming and operating same

MEMS devices include a substrate, an anchor attached to the substrate, and a multilayer member attached to the anchor and spaced apart from the substrate. The multilayer member can have a first portion that is remote from the anchor and that curls away from the substrate and a second portion that is adjacent the anchor that contacts the substrate. Related methods are also disclosed.

MEMS device members having portions that contact a substrate and associated methods of operating

A micromechanical apparatus includes a microelectronic substrate and a tiltable body thereon. The tiltable body includes a plate configured to tilt about an axis parallel to the microelectronic substrate and a tilt stop engaging portion disposed axially adjacent the plate. A range of rotation of the plate about the axis is defined by contact of the tilt stop engaging portion with a tilt stop on the substrate. The microelectronic substrate may have an opening therein configured to receive the plate, and the tilt stop may include a surface of the microelectronic substrate adjacent the opening. An actuator, such as an electrostatic actuator, may tilt the tiltable body about the axis. Related operation and fabrication methods are also described.

Microelectromechanical apparatus with tiltable bodies including variable tilt-stop engaging portions and methods of operation and fabrication therefor

Reduced configuration Optical Cross-Connect (OXC) switches can include N inputs to the OXC switch and N outputs from the OXC switch, where N is at least 3. The N&times;N OXC switch provides N&excl; states, wherein the N&excl; states optically couple any one of the N inputs to any one of the N outputs. The N&times;N OXC switch also includes a number of switching nodes that are selectively optically coupled to the N inputs and N outputs. Each of the number of switching nodes is configurable in at least one of a switching configuration and a pass-through configuration to provide selectively switched optical radiation therefrom and wherein the number of switching nodes is equal to ceiling &lsqb;ln(N&excl;)/ln(2)&rsqb; to provide the N&excl; states of the N&times;N OXC switch. The N&times;N OXC switch further includes at least one optical transmission apparatus coupled to at least two of the switching nodes. Related methods are also disclosed.

MicroElectroMechanical optical cross-connect switches having reduced numbers of reflectors therein and methods of operating same

Microelectromechanical (MEM) Optical Cross-connect (OXC) switches having mechanical actuators are discussed. In particular, the MEM OXC switches can include a plurality of reflectors, wherein each of the plurality of the reflectors is movable to at least one of a respective first reflector position along a respective optical beam path from an associated input of the MEM OXC switch to an associated output thereof and a respective second reflector position outside the optical beam path. A mechanical actuator moves to at least one of a first mechanical actuator position and a second mechanical actuator position. A selector selects ones of the plurality of reflectors to be coupled to the mechanical actuator and at least one of the plurality of reflectors to be decoupled from the mechanical actuator, wherein the mechanical actuator is coupled to the selected ones of the plurality of reflectors in the first actuator position and wherein the mechanical actuator moves the selected ones of the plurality of reflectors from the respective first reflector positions to the respective second reflector positions when the mechanical actuator moves from the first mechanical actuator position to the second mechanical actuator position. Related methods are also discussed.

Microelectromechanical optical cross-connect switches including mechanical actuators and methods of operating same

Microelectromechanical structures (MEMS) are provided that are adapted to controllably move mirrors in response to selective thermal actuation. In one embodiment, the MEMS moveable mirror structure includes a thermally actuated microactuator adapted to controllably move along a predetermined path substantially parallel to the first major surface of an underlying microelectronic substrate. A mirror is adapted to move accordingly with the microactuator between a non-actuated and an actuated position. In all positions, the mirror has a mirrored surface disposed out of plane relative to the first major surface of the microelectronic substrate. The microactuator provided herein can include various thermal arched beam actuators, thermally actuated composite beam actuators, arrayed actuators, and combinations thereof. The MEMS moveable mirror structure can also include a mechanical latch and/or an electrostatic latch for controllably clamping the mirror in position. A MEMS moveable mirror array is also provided which permits individualized control of each individual MEMS moveable mirror structure within the array. The MEMS moveable mirror structures and the associated arrays can be used in a variety of applications including applications involving the controlled redirection of electromagnetic radiation. Accordingly, a method of redirecting electromagnetic radiation is provided. A method of fabricating MEMS moveable mirror structures is further provided.

Moveable microelectromechanical mirror structures and associated methods

A MEMS thermal actuator device is provided that is capable of providing linear displacement in a plane generally parallel to the surface of a substrate. Additionally, the MEMS thermal actuator of the present invention may provide for a self-contained heating mechanism that allows for the thermal actuator to be actuated using lower power consumption and lower operating temperatures. The MEMS thermal actuator includes a microelectronic substrate having a first surface and at least one anchor structure affixed to the first surface. A composite beam extends from the anchor(s) and overlies the first surface of the substrate. The composite beam is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface of the microelectronic substrate. In one embodiment the composite beam comprises two or layers having materials that have correspondingly different thermal coefficients of expansion. As such, the layers will respond differently when thermal energy is supplied to the composite. An electrically conductive path may extend throughout the composite beam to effectuate thermal actuation. In one embodiment of the invention a two layer composite beam comprises a first layer of a semiconductor material and a second layer of a metallic material. The semiconductor material may be selectively doped during fabrication so as to create a self-contained heating mechanism within the composite beam. The invention also comprises a MEMS thermal actuator that includes two or more composite beams. The two or more composite beams may be disposed in an array or a ganged fashion, such that the multiple composite beams benefit from overall force multiplication and are therefore capable of greater and more linear displacement distances. The invention is also embodied in a method for fabricating the MEMS thermal actuators of the present invention.

Methods of fabricating in-plane MEMS thermal actuators

A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.

Variable capacitors including tandem movers/bimorphs and associated operating methods

A microelectromechanical structure capable of switching optical signals from an input fiber to one of two or more output fibers. In one embodiment, the MEMS optical cross-connect switch comprises a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a rotational magnetic field source, such as a variably controlled magnetic field source. The rotational magnetic field source allows for reliable actuation of the pop-up mirror from a non-reflective state to a reflective state. Additionally the invention is embodied in a MEMS optical cross-connect switch having a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a positioning structure disposed in a fixed positional relationship relative to the first substrate. The positioning structure may comprise a positioning structure extending from a second microelectronic substrate that is in a fixed positional relationship relative to the first microelectronic substrate. The positioning structure serves to restrict further movement of the pop-up mirror when the pop-up mirror has been actuated into a reflective state.

MEMS optical cross-connect switch

In embodiments of the present invention, a microelectromechanical actuator includes a beam having respective first and second ends attached to a substrate and a body disposed between the first and second ends having a sinuous shape. The body includes a portion operative to engage a object of actuation and apply a force thereto in a direction perpendicular to the beam responsive to at least one of a compressive force and a tensile force on the beam. The sinuous shape may be sinusoidal, e.g., a shape approximating a single period of a cosine curve or a single period of a sine curve. The beam may be thermally actuated or driven by another actuator. In other embodiments, a rotary actuator includes first and second beams, a respective one of which has first and second ends attached to a substrate and a body disposed between the first and second ends. Each body includes first and second oppositely inflected portions. The bodies of the first and second beams intersect one another at points at which the first and second oppositely inflected portions of the first and second bodies meet. The bodies of the first and second beams are operative to engage the object of actuation and rotate the object of actuation around the point of intersection responsive to at least one of compressive force and tensile force on the first and second beams. Related methods are also described.

Growing community of inventors

Chapel Hill, NC, United States of America

Edward Arthur Hill