Pacific Coast Technologies, Inc.

Pacific Aerospace & Electronics, Inc.

Edward A Taylor

Herman L Jones

Marshall Neal Hulbert

Electronics packages having a primary metallic material, such as a titanium metallic material, metallurgically bonded to one or more secondary regions within the primary metallic material, the composite regions having desirable thermal conductivity properties and having a coefficient of thermal expansion (&ldquo;CTE&rdquo;) that generally matches the CTE of the primary metallic material are provided. Electronics packages comprising titanium having heat sinks comprising a metal matrix material such as aluminum silicon carbide or a composite metallic structure such as titanium aluminide/copper, are described. Methods for manufacturing electronics packages having a composite structure are also disclosed.

Electronics packages having a composite structure and methods for manufacturing such electronics packages

Composite materials are composed of a primary metallic base material, such as a titanium metallic material, metallurgically bonded to one or more secondary materials having desirable thermal conductivity properties and having a coefficient of thermal expansion (&ldquo;CTE&rdquo;) that generally matches the CTE of the primary metallic material. An exemplary composite material is composed of a titanium primary material metallurgically bonded to a secondary metal matrix composite material having a high thermal conductivity, such as aluminum silicon carbide. Methods for manufacturing such composite materials are disclosed.

Composite materials and methods for manufacturing composite materials

A microwave electronics package has a microwave waveguide window assembly hermetically sealed to the electronics package using an intermediate bimetallic bushing. The metallic components of the bimetallic bushing have thermal properties similar to the thermal properties of the housing and waveguide window frame, respectively, permitting the use of fusion welding techniques such as laser welding to hermetically seal the waveguide assembly in the housing and to preserve the integrity of the waveguide window during fusion welding and during thermal cycling of the electronics package. A microwave grounding element is also provided in the assembled electronics package to provide a continuous microwave ground path.

Waveguide window assembly and microwave electronics package

Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The apparatus of the present invention are especially suitable for hermetically sealing metal matrix composite electronics packages.

Sealable electronics packages

Apparatus and methods for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The methods and apparatus of the present inventions are especially suitable for hermetically sealing metal matrix composite electronics packages.

Sealable electronics packages and methods of producing and sealing such

Connectors are provided which afford a substantial material match between two dissimilar metals, such as between an electronics package and the connector as well as between connector components to form an electronics assembly. In this manner, the thermal expansion properties of the electronics assembly components to be interfaced are also substantially matched, thereby allowing maintenance of a hermetic feedthru formed therebetween for a sustained period of operation. Additionally, the substantially matched component materials permit the use of simple and cost effective interfacing procedures in assembly construction.

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East Wenatchee, WA, United States of America

Edward A Taylor