International Business Machines Corporation

Edward A Giess

Emanuel Israel Cooper

Young-Ho Kim

Thomas M Shaw

George Frederick Walker

Shaji Farooq

Sarah Huffsmith Knickerbocker

Robert Anthony Rita

Rao Venkateswara Vallabhaneni

Peter Richard Duncombe

Jae M Park

Jungihl Kim

Robert R Shaw

Mark O Neisser

Farid Youssif Aoude

Friedel Muller-Landau

Jon A Van Hise

James M Brownlow, Deceased

Carlos Juan Sambucetti

Ravi F Saraf

Steven Paul Ostrander

Judith Marie Roldan

Richard B Booth

Sol Krongelb

Mark R Kordus

The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Fabrication of double side fully metallized plated thru-holes, in

Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Process for producing ceramic circuit structures having conductive vias

Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Via paste compositions and use thereof to form conductive vias in

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Purdys Station, NY, United States of America

Edward A Giess