Siemens Aktiengesellschaft

Siemens Aktiengesell Schaft

Eduard Schonberger

Heinz Schmidt

Hermann Kasowski

Stefan Gruber

An injection-molded part (1) includes elevations (2) and/or depressions (12) arranged between integrated printed conductors (4). If the elevations (2) or depressions (12) are uncoated and thus electrically insulating, they increase the effective voltage clearances between the printed conductors (4) and the components (3) arranged next to the printed conductors (4). The geometric distances can then be reduced. Alternatively, by electroconductively coating the elevations (2), electric and magnetic shielding is achieved in a simple manner. A cover (6) is provided as a top of a box which uses elevations (2) as side walls. A tapering portion (5) connects coatings (7,7') of the cover (6) and elevations (2) via a printed conductor (8) running diagonally across the tapering portion (5).

Diagonal printed conductor connecting metal coatings of two walls of a

An insulating part for an electronic device includes a first metallized outer surface capable of cooling one or more electronic components disposed on the insulating part. The insulating part also includes one or more additional metallized outer surfaces, such as a set of cooling ribs, to provide improved cooling for the electronic components. These additional outer surfaces are coupled electrically and thermally to the first metallized outer surface, and to each other by recesses containing a heat transfer element, such as a metallization or a soldered connection. Thus, heat transferred to the first outer surface is further dissipated among the several additional cooling surfaces.

Insulating part with improved heat transfer element

An insulating part for an electronic device includes a body having a metallized outer surface and a heat sink arranged within the body. The heat sink is thermally coupled to an electronic component and to the metallized outer surface, and may also be either electrically coupled or electrically isolated from the electronic component. The insulating part is preferably made of plastic by an injection-molding process, while the heat sink is preferably a metal block integrally formed within the insulating part.

Insulating part with integral cooling element

Previously known circuit boards as components of devices having a housing have a plastic rear wall of the housing and the circuit board creates a connection between at least two printed circuit boards in the housing. Furthermore, processes for the production of three-dimensional printed circuits are known. Taking these as a point of departure, a one-piece circuit board as an integral portion of the housing of the device is created. One that not only produces the function of an electrically-conductive connection between the aforementioned printed circuit boards, but also serves as a mounting for the printed circuit boards, i.e., it can assume mechanical functions. This is solved by virtue of the fact that the rear wall (1) of the housing consists of plastic and embodies a circuit board having metallized strip conductors (2) and flat surfaces (3) that conduct electricity. And, on the interior of the rear wall (1), protruding connectors are moulded. The latter are themselves metallized, and they are, by dint of the strip conductors (2) and/or the flat surfaces (3), connected with one another so as to conduct electricity. The printed circuit boards ( 5) may be connected electrically to the connective media (4). Such circuit boards may be used in devices that provide automation.

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Kummersbruck, Germany

Eduard Schonberger