Intel Corporation

Eduard Roytman

Mahalingam Nagarajan

Rahul R Shah

Kemal Aygun

Zhiguo Qian

Sanka Ganesan

Jeff C Morriss

Yidnekachew S Mekonnen

Kambiz R Munshi

Jian Xu

Ronald L Bedard

Pradeep R Vempada

Sanjay Dabral

David Stewart Dunning

Theodore Zale Schoenborn

Mathew J Manusharow

Maurice B Steinman

Wilfred Gomes

Ram S Viswanath

Rajasekaran Swaminathan

Naveen Cherukuri

Tim Frodsham

Sriram Srinivasan

Richard J Dischler

Gregorio R Murtagian

Yu Zhang

Yu Amos Zhang

Integrated circuit (IC) chip die to die channel interconnect configurations (systems and methods for their manufacture) may improve signaling to and through a single ended bus data signal communication channel by including on-die induction structures; on-die interconnect features; on-package first level die bump designs and ground webbing structures; on-package high speed horizontal data signal transmission lines; on-package vertical data signal transmission interconnects; and/or on-package electro-optical (EO) connectors in various die to die interconnect configurations for improved signal connections and transmission through a data signal channel extending through one or more semiconductor device package devices, that may include an electro-optical (EO) connector upon which at least one package device may be mounted, and/or be semiconductor device packages in a package-on-package configuration.

Rlink&#x2014;die to die channel interconnect configurations to improve signaling

A vertically ground isolated package device can include (1) ground shielding attachment structures and shadow voiding for data signal contacts; (2) vertical ground shielding structures and shield fencing of vertical data signal interconnects; and (3) ground shielding for an electro-optical module connector of the package device. These reduce cross talk between data signal contacts, attachment structures and vertical 'signal' interconnects of the package device. The ground shielding attachment structures may include patterns of solder bumps and/or surface contacts. The shadow voiding may be surrounding voids in ground planes that are larger than the data signal solder bumps. The vertical ground shielding structures may include patterns of ground shield interconnects between the vertical data signal interconnects: The shield fencing may include patterns of ground plated through holes (PTH) and micro-vias (uVia). The ground shielding for the electro-optical module may include patterns of ground isolation shielding attachments and contacts.

Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices

In some embodiments, a differential amplifier with duty cycle correction is provided.

Forwarded clock jitter reduction

Described herein are an apparatus, system, and method for compensating voltage swing and duty cycle of a signal on an input-output (I/O) pad of a processor by adjusting the voltage swing and duty cycle of the signal. The apparatus comprises a driver to transmit a signal on an I/O pad, the signal on the I/O pad having a voltage swing and a duty cycle; and an adjustment unit, coupled to the driver, to receive the signal from the I/O pad transmitted by the driver and to generate voltage swing and duty cycle control signals for adjusting the voltage swing and duty cycle of the signal on the I/O pad respectively. Described herein is also an analog-to-digital (A2D) converter for measuring and/or calibrating various signal attributes including current, voltage, and time.

Apparatus, system, and method for voltage swing and duty cycle adjustment

A transmitter architecture includes an equalizer and a D/A converter, for high-speed transmission of data across a channel. The equalizer includes a two-tap MAC as part of an N-stage, two-way interleaved FIR filter. The two-tap MAC provides substantial power and area savings over conventional MAC-based FIR filter designs, and may be implemented in short or long communications channels. The D/A converter is decoupled from the equalizer. Its N-bit, binary-weighted driver includes matched unit current generation cells, all of which are fully utilized during each digital-to-analog conversion. The D/A converter remains unchanged, even when the characteristics of the equalizer are changed.

Transmitter architecture for high-speed communications

Methods and apparatuses for determining clock failure for a multi-agent system employing a link-based interconnection scheme using a forwarded clock. For one embodiment of the invention, the cessation of the forwarded clock initiates a clock failure determination process. For one embodiment of the invention, upon a determination of clock failure, an alternate clock lane is implemented using a pre-designated data lane.

Methods and apparatuses for detecting clock failure and establishing an alternate clock lane

Growing community of inventors

Newton Centre, MA, United States of America

Eduard Roytman