Infineon Technologies Ag

Eduard Knauer

Joachim Mahler

Khalil Hosseini

Juergen Hoegerl

Angela Kessler

Irmgard Escher-Poeppel

Andreas Grassmann

Wolfgang Schober

Stefan Landau

Wolfram Hable

Peter Scherl

Thomas Behrens

Rudolf Lehner

Raimund Foerg

Konrad Roesl

Thomas Kunstmann

Michael Ledutke

Rupert Fischer

Sigrid Schultes

Peter Mederer

A package comprising at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, a first electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with at least one first terminal of at least one of the at least one electronic chip, and a second electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with at least one second terminal of at least one of the at least one electronic chip, wherein at least a portion of the first electrically conductive contact structure and at least a portion of the second electrically conductive contact structure within the encapsulant are spaced in a direction between two opposing main surfaces of the package.

Package with vertically spaced partially encapsulated contact structures

An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device.

Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and connecting the metal layers such that a single metal layer is formed.

Electronic device and method for fabricating an electronic device

A semiconductor device has a circuit carrier with a number of internal contact areas is disclosed, which includes a first material with a first electrochemical potential, and a semiconductor chip with an active surface and a number of chip contact areas, which include a second material with a second electrochemical potential. Bonding wire connections are arranged between the chip contact areas and the internal contact areas of the leadframe and comprise a third material with a third electrochemical potential. The connecting points between the chip contact areas and the bonding wires and/or the connecting points between the internal contact areas and the bonding wires are coated with an anticorrosive layer.

Semiconductor device and method for producing the same

A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.

Semiconductor device with conductive die attach material

Growing community of inventors

Wuppertal, Germany

Eduard Knauer