Henkel Kommanditgesellschaft Auf Aktien

Eduard Franciscus Taal

Herbert Fischer

Andreas Ferencz

Ruediger Voss

Heike Eisenberger

Heike Eisfeld

The invention relates to a low-viscosity hotmelt adhesive containing A) at least one hydrocarbon resin solid at 20&deg; C. with a softening temperature of 70 to 140&deg; C., B) at least one oil with an average molecular weight of >500 and preferably C) a styrene block copolymer. The new hotmelt adhesive is distinguished by a melt viscosity of essentially only 500 to 3200 mPas at 150&deg; C. for a softening temperature of 60 to 115&deg; C. It is preferably used in the field of hygiene for bonding films, nonwovens and/or shaped articles of cellulose derivatives, being distinguished by particular resistance to dermatologically compatible coatings.

Hot-melt adhesive of low viscosity

An adhesive useful in forming composites includes components A and B. Component A includes at least one polyester with a molecular weight (M ) of at least 8000 and has a total enthalpy of fusion of at most 20 mJ/mg. Component B includes at least one polyester with a molecular weight (Mn) of less than 8000 and a glass transition temperature of at most 60&deg; C. The adhesive preferably has a melt viscosity of 500 to 25,000 mPas (Brookfield RVT DVII, 140&deg; C., spindle 27) and a softening point of 70 to 100&deg; C. (ASTM E28).

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Duesseldorf, Germany

Eduard Franciscus Taal