Semikron Elektronik Gmbh &co.kg

Suspa Gmbh

Eduard Faller

Edgar Prottengeier

Matthias Spang

Ludwig Haas

Lars Reuβer

A power semiconductor module comprising internal load and auxiliary connection devices embodied as wire bonding connections. A substrate has a plurality of load and auxiliary potential areas, wherein a power switch is arranged on a first load potential area, said power switch being embodied as a plurality of controllable power subswitches arranged in series. The power subswitches have a load bonding connection consisting of a plurality of load bonding wires to a second load potential area, wherein a first bonding base is arranged on the second load potential area and an adjacent second bonding base of the respective load bonding wire is arranged on a contact area of the power subswitch.

Power semiconductor module comprising module-internal load and auxiliary connection devices of low-inductance configuration

A height-adjustable actuation device comprises a drive for height adjustment of the actuation device; a casing having a longitudinal axis; a hollow spindle arranged in the casing for displacement of a first lid arranged on the hollow spindle along the longitudinal axis; an internal spindle arranged inside the hollow spindle for displacement of a second lid arranged on the internal spindle along the longitudinal axis, with the hollow spindle and the internal spindle being non-rotatably connected to each other in terms of a rotation about the longitudinal axis, and with the hollow spindle and the internal spindle being displaceable relative to each other along the longitudinal axis.

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Fürth, Germany

Eduard Faller