Intel Corporation

The State University of New York

Edris M Mohammed

Ibrahim Ban

Ian A Young

Henning Braunisch

Kimin Jun

Hinmeng Au

Matthew V Metz

Paul B Fischer

Kevin Lai Lin

Daoqiang Lu

Peter Chang

Peter L D Chang

Hengju Cheng

Arnab Sen Gupta

Kevin P O'brien

Michael Yakimov

Serge Oktyabrsky

Jobert VanEisden

Ved V Gund

Vadim Tokranov

In one embodiment, a resonator device includes a substrate comprising a piezoelectric material and a set of electrodes on the substrate. The electrodes are in parallel and a width of the electrodes is equal to a distance between the electrodes. The RF resonator device further includes a set of switches, with each switch coupled to a respective electrode. The switches are to connect to opposite terminals of an alternating current (AC) signal source and select between the terminals of the AC signal source based on an input signal.

Digitally controlled lithographically-defined multi-frequency acoustic resonators

The RF filters used in conventional mobile devices often include resonator structures, which often require free-standing air-gap structure to prevent mechanical vibrations of the resonator from being damped by a bulk material. A method for fabricating a resonator structure comprises depositing a non-conformal thin-film to the resonator structure to seal air gap cavities in the resonator structure.

Resonator structure encapsulation

Systems and methods may couple on-chip optical circuits to external fibers. An SOI waveguide structure may include mirror structures and tapered waveguides to optically couple optical circuits to fibers in a vertically oriented external connector. The mirror structure(s) may be angularly disposed at the ends of the silicon waveguide structure. An oxide layer may cover a buried oxide layer and the silicon waveguide structure. The tapered waveguide(s) may have a narrow end and a wide end. The narrow end of the tapered waveguide(s) may be disposed above the mirror structures. The tapered waveguide(s) may extend through the oxide layer from the narrow end in a direction perpendicular to the silicon waveguide structure. An external connector may fit over the tapered waveguide(s) and uses a fiber array traveling through a connector body to optically couple to the external fiber.

Optical photonic circuit coupling

Systems and methods may provide for an integrated miniature sensor that operates in the Terahertz region of the electromagnetic spectrum. The integrated miniature sensor may detect a remote target and operate in a non-contact, non-invasive manner. Numerous signal analysis techniques may be employed such as Doppler radar technology, absorption spectroscopy, and others when the integrated miniature sensor is used in biomedical, physiological and other settings where prolonged recording of bio-signals is needed.

Integrated Terahertz sensor

Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.

Electro-optical assembly including a glass bridge

Described herein are a method to manufacture an optical sub-module which integrates both optical (e.g., micro-lens, optical filter, micro-mirrors) and/or electrical passive devices (e.g., capacitors, inductors, resistors) and systems on a wafer level. Such integration eliminates several assembly steps and therefore improves the optical misalignment tolerance for the optical link.

Wafer integrated optical sub-modules

Self alignment of Optoelectronic (OE) chips, such as photodiode (PD) modules and vertical cavity surface emitting laser (VCSEL) modules, to external waveguides or fiber arrays may be realized by packaging the OE chips directly in the fiber optic connector.

Surface mount (SMT) connector for VCSEL and photodiode arrays

Embodiments are directed to an apparatus and fabrication method to form pad arrays on the edge of a substrate wafer substrate. Embodiments of the invention make it possible for surface mount devices to be bonded vertically (i.e. on their side) using standard semiconductor assembly processes.

Method to form lateral pad on edge of wafer

A detuned duo-cavity laser-modulator device and method are provided which include lower, middle and upper reflectors, a gain region and an absorber region integrated into a semiconductor die. The middle reflector is disposed between the lower and upper reflectors. Together, the lower and middle reflectors define a first resonant cavity, while the upper and middle reflectors define a second resonant cavity. A gain region is disposed within a laser cavity of the resonant cavities to generate an optical carrier wave, while an absorber region is disposed within a modulator cavity of the resonant cavities to modulate a signal on the optical carrier wave. The laser and modulator cavities are detuned resonant cavities, with the detuning of the laser and modulator cavities being selected to minimized change in reflection from the modulator cavity to the laser cavity when the absorber region modulates the signal on the optical carrier wave.

Detuned duo-cavity laser-modulator device and method with detuning selected to minimize change in reflectivity

A system is disclosed. The system includes a printed circuit board (PCB), a substrate mounted on the PCB, an integrated circuit (IC) mounted on the substrate, an optoelectronic sub-assembly mounted on the substrate and coupled to the IC; and a waveguide patterned on the substrate.

Optical sub-assembly

An optical-electrical interface includes an alignment interface and an optoelectronic die. The alignment interface is mounted to a substrate and includes a waveguide port to receive an external waveguide from a first side. The alignment interface includes a conductor disposed on a second side of the alignment interface to couple to a conductor on the substrate. The optoelectronic die is mounted to the second side of the alignment interface. The optoelectronic die includes an electrical port coupled to the conductor disposed on the alignment interface, an optoelectronic device coupled to the electrical port and an optical port aligned to optically couple the optoelectronic device to the external waveguide through the alignment interface.

Growing community of inventors

Hillsboro, OR, United States of America

Edris M Mohammed