Ge Precision Healthcare LLC

General Electric Company

Edouard Dacruz

Flavien Daloz

Jason Barrett

Frederic Lanteri

Alan Tai

Giandonato Stallone

Maxence Borot

Jean-Marc Baraban

Matthieu Petitprez

Fan Zheng

Jeremie Barrel

Systems and methods are provided for cleanable and sterilizable electrical connector for medical devices. A sterilizable connector may include a first shell and a second shell configured to engage one another, a nose housing that includes a mating area of the connector for engaging a corresponding mating area in a component of a medical device, and an overmolding that overmolds a combination of the first shell, the second shell, and the nose housing. Each of the first shell, the second shell, and the nose housing includes a first material that is compatible with cleaning and sterilization (C&S) treatment. The overmolding includes a second material that provides sealing of the combination of the first shell, the second shell, and the nose housing during the cleaning and sterilization (C&S) treatment. The connector is configured to enable applying at least sterilization without requiring closing or covering of the mating area of the connector.

Cleanable and sterilizable electrical connector for medical devices

Various methods and systems are provided for a multi-frequency transducer array. In one example, ground recovery in the transducer array is enabled by configuring an acoustic stack of the transducer array with an interdigitated structure, a top layer coupled to a front side of the interdigitated structure, and a bottom layer coupled to a back side of the interdigitated structure, where the top layer and the bottom is electrically continuous with the interdigitated structure.

Methods and systems for ground recover in a transducer array

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub-elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.

Methods and systems for a multi-frequency transducer array

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.

Methods and systems for multi-frequency transducer array fabrication

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.

Methods and systems for wafer scale transducer array fabrication

Various methods and systems are provided for maintaining polarization of an ultrasound probe and increasing image quality of an image generated during an imaging procedure. As one example, a method for an ultrasound imaging system may include executing one or more imaging sequences with an ultrasound transducer; and applying a repolarization sequence to the ultrasound transducer one or more of before, after, and interleaved between the one or more imaging sequences, where the repolarization sequence is separate from the one or more imaging sequences.

Growing community of inventors

Nice, France

Edouard Dacruz