Intel Corporation

Motorola Corporation

Edoardo Campini

Mark D Summers

William Handley

Steven Denies

Lawson Guthrie

Javier Leija

David Formisano

Douglas Lee Stahl

Hassan Fallah-Adl

Robert J Albers

Marwan Khoury

Curtis Lee Cornils

Douglas P Bogia

Donald Charles Cohlman

Ho Wang

Jacek Budny

Gerard Wisniewski

James Donald Crowe

Frank Geoffrey Gates

Jay G Gilbert

Brian Mitchel Cover

Andy Saffarian

Shailesh Chaudhry

Jerome A Saint Cyr

Arsham Andy Saffarian

Jerome A Saint-Cyr

Paul Sharrit

Bradley T Herrin

Bradley Herrin

A telecommunications chassis includes an array of mezzanine card interfaces and a carrier module coupled to the mezzanine card interfaces to control and manage mezzanine cards connected to the mezzanine card interfaces.

Telecommunications chassis having mezzanine card interfaces

A data transport module includes a connector to be received and coupled to a backplane within a modular platform. The data transport module also includes another connector to be received and coupled in a slot resident on a board such that the data transport module is coplanar to the board when received and coupled in the slot. The data transport module further includes one or more data transport interfaces to forward data between the board and the backplane via the connectors.

Data transport module

Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.

Telecommunications chassis having mezzanine card slots

Techniques that determine a strict subset of multiple processor cores from a set of multiple functional processor cores integrated within a single integrated circuit package. The determined strict subset of multiple processor cores differs from a previously determined strict subset of multiple processor cores from the set of multiple functional processor cores used to initiate an immediately previous core booting. In response to a processor reset, booting of the strict subset of multiple processor cores is initiated. Also, support for selecting multiple modes of operations, either supporting fault tolerance or extended life.

Determining a set of processor cores to boot

Method and apparatus to couple a module to a management controller on an interconnect

A configurable multi-faceted input/output (I/O) panel may be used in a computer or electronic device to present multiple I/O interfaces to a user. The configurable multi-faceted I/O panels may be configured by a user such that one of a plurality of different I/O faces is accessible to the user. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Configurable multi-faceted input/output panel

In one embodiment, the present invention includes a semiconductor package having a plurality of fan blades embedded within a first surface of the package, where a first group of the fan blades extend from a first side of the package and a second group of the fan blades extend from a second side of semiconductor package. The fan blades may be powered by piezoelectric devices to cause motion of the fan blades. Other embodiments are described and claimed.

Piezoelectric cooling of a semiconductor package

An apparatus, method, computer program product, integrated circuit and system that include a backplane that provides direct and indirect connections among a plurality of slots in communication with the backplane. The backplane is also complies with a telecommunication architecture specification. The slots include at least a source slot, an intermediate slot and a destination slot. The intermediate slot may receive a first data set from the source slot via the backplane. The intermediate slot sends the first data set to the destination slot via the backplane.

Backplane interconnection system and method

A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Thermal management device attachment

A reconfigurable interconnect/switch for selectably coupling network devices, media, and switch fabric. The reconfigurable interconnect/switch enables network devices, such as network processor units (NPUs) to selectively communicate with other NPUs, media (via a media interface), and switch fabric (via a switch fabric interface), thus providing flexibility in the use of network line cards and the like. Embodiments of the switching/routing scheme may be employed to support network devices having separate media and/or switch fabric interfaces, as well as network devices having selectable media switch fabric (MSF) interfaces that share signal lines.

Reconfigurable interconnect/switch for selectably coupling network devices, media, and switch fabric

A method to couple a module to a board including power circuitry. The method includes detecting a module's power requirements before providing payload power to the module and routing a regulated power level to the module via at least one power feed based on the detected power requirements. The regulated power is provided by the board's power circuitry.

Providing power to a module

Information is obtained from a module received in a slot in a chassis. The information includes a number of ports in one or more module connectors which route at least one communication channel associated with a communication interfaces on the module. A determination is made as to the number of ports the slot has a capability to route the at least one communication channel to one or more backplanes in the chassis and to another module received in another slot in the chassis. A given number of ports in the one or more module connectors are enabled to forward data from the communication interface on the module and through the at least one communication channel to the other module based on the determination.

Enabling ports on a module received in a slot in a chassis

A chassis includes a plurality of slots to receive modules. The chassis further includes a first backplane to couple to modules that are received in the plurality of slots. The modules are to couple to the first backplane via a first communication interface on each module. The chassis also includes a second backplane to couple to at least a subset of the modules via a second communication interface on each of the subset of modules. One of the backplanes may be located in an upper or lower air plenum and used to interconnect modules slid along the slots from opposite directions. Some of the module connectors may be retractable to enable the modules to move into the chassis. The interface may be electrical, optical inductive or capacitive.

Module to couple to a plurality of backplanes in a chassis

An apparatus and system includes a radiation generation device for generating radiation and a radiation detection device. A first radiation channel is optically-coupled on a first end to the radiation generation device and configured to direct the radiation generated by the radiation generation device to a second end of the first radiation channel. A second radiation channel is optically-coupled on a first end to the radiation detection device and configured to direct radiation from a second end of the second radiation channel to the radiation detection device. An optical switch is configured to selectively interrupt the transmission of radiation from the second end of the first radiation channel to the second end of the second radiation channel.

Radiation switch

A shock absorbing system may be mounted on a circuit board, such as a carrier card, to reinforce the circuit board and/or to absorb shock forces from a neighboring circuit board, such as a mezzanine card coupled to the carrier card. The shock absorbing system may include one or more support members extending across at least a portion of the carrier card. One or more rollers may be supported on the support member(s) in a manner that allows rotation to facilitate insertion and/or extraction of mezzanine cards from the carrier card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Growing community of inventors

Mesa, AZ, United States of America

Edoardo Campini