Abbott Diabetes Care Inc.

Extel Corporation

Abbott Laboratories Corporation

Teletype Corporation

Edmund T Marciniec

Yi Wang

Timothy P Henning

Ted J Hanagan

Steven G Schultz

Kenneth S Johnson

John D Norlie, Jr

Jay R Ford

Lance K Safford

The subject invention provides conductive stripes, suitable for use as electrodes, and methods of making conductive stripes.

Method of making, and, analyte sensor

Methods of making, and, analyte sensor

The present invention provides a diagnostic flow cell for determining the presence or amount of an analyte which may be contained in a test sample. The flow cell comprises a spacing layer having a longitudinal void disposed between a pair of opposed substrates. The spacing layer and the opposed substrates define a flow channel wherein reagent means can be immobilized. When the immobilized reagent means is contacted with an analyte, the reagent means can produce an electrically, optically, or electrically and optically detectable response to the analyte. Hence, the reagent means that is immobilized within the flow channel can comprise (i) a counter electrode, a reference electrode and a working electrode, (ii) an optically sensitive dye or (iii) a counter electrode, a reference electrode and a working electrode and an optically sensitive dye. The flow cell can be interfaced with means for introducing a test sample into and out of the flow cell's flow channel and detection means for detecting a signal generated by the immobilized reagent means. The present invention also provides methods for detecting the presence or amount of an analyte which may be contained in a test sample.

Diagnostic flow cell device

A dielectric substrate for a thin film dot matrix thermal print head has its working surface etched or otherwise treated for selective removal of the dielectric material in all areas that are to constitute electrical connectors for the resistance heater print elements, to a depth approximately equal to the sum of the thicknesses of all of the conductive films to be applied to the substrate surface in those areas, following which the working surface of the substrate is selectively coated with films of high-resistance electrically conductive material and low-resistance conductive material, with suitable adhesion films as required, to complete the operating elements of the print head. An outer protective wear-resistant film may also be employed on the entire print head surface or on only the electrical connector areas. The print head has its resistance heater print elements and its blank spaces all raised to approximately the same level as the outer surfaces of the electrical connectors affording improved performance and longer operating life; the etching of the substrate is effected by a process that leaves positive transition slopes to assure effective electrical connections to the print elements.

Thin film thermal print head

A dielectric substrate for a thin film dot matrix thermal print head has its working surface etched or otherwise treated to selectively remove the dielectric material, in all areas which will constitute electrical connectors for the resistance heater print elements, to a depth at least equal to the sum of the thicknesses of all of the conductive films to be applied to the substrate surface in those areas, following which the working surface of the substrate is selectively coated with films of high-resistance electrically conductive material and low-resistance conductive material, with suitable adhesion films as required, to complete the print head. An outer protective wear-resistant film is also employed. The resultant print head has its resistance heater print elements and blank surface elements raised at least to the same level as the outer surfaces of the electrical connectors, and preferably slightly higher, to provide improved performance and operating life.

Method of manufacturing thin film thermal print heads

The cleanliness of silicon wafers is evaluated. At various stages of I.C. manufacture, silicon wafers may contain undesirable inorganic and organic contaminants and residues, the presence of which may be due to initial growing and slicing or to subsequent manufacturing steps such as the removal of photoresists. The present method involves differential etching of the silicon wafers. In a manner that removes silicon at a much faster rate than the contaminants and residues are removed. The differential etching is effected by subjecting the wafers to a low pressure, low temperature, RF, reactive plasma which includes a halocarbon gas, and oxygen for a time sufficient to texture the wafer. The differential etching continues at least until the onset of texturing which replicates the pattern of contaminants or residues initially present thereon for visual inspection.

Growing community of inventors

Libertyville, IL, United States of America

Edmund T Marciniec