Motorola Corporation

Edmund B Boucher

Jose L Diaz

Harold M Cook

Jeffrey A Rollman

Curtis M Griffin

A reversible heat sink packaging assembly ( ) for integrated circuits is provided. The packaging assembly ( ) includes a chip carrier ( ) having an opening ( ) formed therein and a heat sink ( ). The heat sink ( ) is attached to one side of a die ( ). The die ( ) fits into the opening ( ) of the carrier ( ) with the heat sink ( ) abutting one side ( ) of the carrier and the die being wire bonded ( ) to the other side ( ) of the carrier. The packaging assembly ( ) can be oriented either device side up or down.

Reversible heat sink packaging assembly for an integrated circuit

An electronic component ( ), such as a power transistor, is formed of a molded plastic package having top ( ), bottom ( ) and side ( ) surfaces and electrical contacts. A lead frame ( ) attaches to one of the contacts and wraps about the component ( ) so as to provide heat dissipation capability from the bottom and top surfaces of the molded plastic package.

Thermal dissipation package for an electrical surface mount component

A multiple substrate mounting frame (,) includes first (,) and second (,) surfaces and a plurality of windows or cavities (,). A set of substrates having electrical circuitry (,) are attached and electrically connected to the first surface (,) of the mounting frame (,). The second surface (,) can then be electrically interconnected to a mother board (,). A leadless surface mountable assembly for multiple die (,) includes the mounting frame (,) which receives a plurality of substrates (,) and electrically interconnects them to each other and/or to a mother board (,). A heat sink (,) can be provided if the die (,) generate too much heat.

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Fort Lauderdale, FL, United States of America

Edmund B Boucher