Motorola Corporation

Ed Myszka

Michael S Lebby

Thomas H Blair

An interconnect substrate is provided. The interconnect substrate has a first surface with a conductive path and an end surface. The first surface and the end surface join to form a nexus or a corner. A conductive contact is positioned at the nexus, thereby bridging the first surface and the end surface, as well as providing a conductive path from the first surface to the end surface. The conductive contact is operably coupled to the conductive path.

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St. Charles, IL, United States of America

Ed Myszka