Siemens Aktiengesellschaft

Bsh Bosch Und Siemens Hausgeraete Gmbh

Ict Integrated Circuit Testing Gesellschaft Fur Halbeleiterpruftechnik

Eckhard Wolfgang

Karl Weidner

Hans-Peter Feuerbaum

Jörg Zapf

Herbert Schwarzbauer

Reinhold Kuhnert

Dan Neumayer

Johann Otto

Peter Tichy

Martin Honsberg-Riedl

Walter Springmann

Andreas Schlögl

Peter Rummel

Wolfgang Schnell

Günter Zschau

Klaus Zibert

A device wherein food can be warmed by means of induction, said device comprising at least one secondary coil which is formed from a current conductor, whereon at least one heating element is connected. The invention also relates to a device which is used to transfer energy in a device in order to warm food by means of induction, said device comprising a primary coil which is connected to a voltage source and which is formed from a current conductor. According to the invention, the primary and secondary coil is cast into a coil body by casting means, and the insulating casting means exhibits a coefficient of thermal expansion which essentially corresponds to the coil body.

Device for warming food by means of inductive coupling and device for transferring energy

An inductive component, for the formation of a magnetic circuit has at least one wire winding and at least one core with a ferromagnetic core material. The core comprises a gap and at least one further gap to interrupt the magnetic circuit. The inductive component is characterized in that the gaps each have a gap width of at least 1.0 mm. The core comprises two pieces, for example, which are arranged opposed to each other across the gaps and separated from each other by the gap width. The component is advantageously symmetrical with an essentially equal gap width for the gaps. A miniaturized inductive component is possible by the use of a hire winding made from high frequency braided wire and core material capable of accepting high frequencies, which has a high Q-factor even on a high power throughput and thus low electrical losses. In order to increase the Q-factor, the inductive component also has a cooling device for cooling the wire winding. The device is thus provided with a composite material with a thermally-conducting filler. The inductive component is used in a so-called electronic ballast (EVG) in the field of illumination.

Inductive component and use of said component

A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.

Method of manufacturing self-supporting contacting structures

A device () comprises a container () for a liquid coolant () that is disposed between the axis () and the surface () facing the axis to co-rotate with the surface. The device is further provided with an atomizer nozzle () of the container, facing the surface, from which the coolant is discharged during rotation of the container due to the centrifugal force (F) acting upon the coolant of the container in the form of an atomized jet () that strikes the surface. The device cools a surface of an electronic device () that runs hot, the electronic device supplying the X-ray source of a computer tomograph with power and rotating about the axis of the gantry () of the tomograph.

Device for cooling surface that rotates about a rotation axis and that faces the rotation axis

Nine bidirectionally blocking power components are attached on a substrate in the form of a three-row matrix. The power components are attached between three respective current conductors arranged parallel to each other above and below the power components. The current conductors above the matrix proceed at a right angle relative to the current conductors under the matrix. The interconnects to the gate and auxiliary emitter terminals are situated on or in a thin insulating printed circuit board or film and are secured to the corresponding contacts of the chips in recesses of the current conductors.

Matrix converter

A semiconductor module having a high dissipated power has an electrically insulating and thermally conducting layer of crystalline carbon provided between a semiconductor chip and a heat elimination element, whereby the semiconductor chip, the insulating layer and the heat elimination element are connected via an intermediate layer and via connecting layers of silver by pressure sintering. For low-voltage applications, a layer of amorphous carbon can alternatively be employed instead of the layer of crystalline carbon. Extremely low heat transmission resistance between the semiconductor chip and the heat elimination element is provided.

Semiconductor module having high insulating power and high thermal

Method and apparatus for analyzing errors or failures in integrated circuits wherein the integrated circuit is displayed on the picture screen of a work station (AS) and the circuit is excited with a test signal such that at least one measuring location is selected on a malfunction path and an actual signal tappable at this measuring location is compared to a rated signal and wherein the fault location is identified from the comparison results at the measuring locations. The object is to execute a method using an electron beam testing apparatus (EMG) such that the simplest possible measured data transfer occurs. For this purpose the selection of the measuring location on the malfunctioning path proceeds such that a portion (23) of the layout of the integrated circuit corresponding to the measuring location is displayed on the picture screen of the work station and the measuring location is marked by a cursor (24) and position signals depending on the positon of the cursor (24) are supplied to the electron beam measuring apparatus for aligning the electron beam (2) to the measuring location and such that the electron beam testing apparatus is utilized for the identification of the actual signal.

Method and apparatus for analyzing errors in integrated circuits

A particle probe is positioned to a specific region when an actual position of the specific region appears shifted relative to its rated position due to local fields, and can therefore not be defined with high precision. The particle probe is positioned to a prescribed region. The particle probe is then deflected in the environment of this region such that the particle probe impinges different regions at the prescribed region. The position of the specific region is determined from the measured signals which are triggered given incidence of the particle probe on the different regions. The particle probe is then positioned to the specific region. An electrical line may form a test spot at the specific region wherein one dimension thereof is greater than a width thereof.

Method and apparatus for automatically positioning a particle beam

A method for the contactless measurement of the potential waveform in an electronic component with a scanning electron microscope in which the electron beam is aimed at a measuring point of the integrated circuit until at least one phase range of the measuring voltage is determined by phase-shifting the pulses of the primary electron beam with respect to the measuring voltage and subsequently, the electron beam jumped to at least one further measuring point where a phase range is determined in the same manner permitting measurement of the potential waveform at different points of the integrated circuit and displayed together on a picture screen.

Growing community of inventors

Munich, Germany

Eckhard Wolfgang