Robert Boschgmbh

Eckart Schellkes

Florian Grabmaier

Vijaye Rajaraman

Eric Ochs

Frieder Haag

Christoph Gmelin

Conrad Haeussermann

Lars Sodan

Wolfgang Woernle

Holger Hoefer

Reinhold Herrmann

Alexander Lux

Chia-Yu Liu

Timo Lindemann

Roland Seitz

Lutz Rauscher

Yee-Wen Yen

Wallace Chuang

Florian Guffarth

Jens Vollert

Thomas Klaus

Aline Welter

A solder paste includes a first solder alloy powder in an amount ranging from 30% to 95% by weight. The first solder alloy powder includes a first solder alloy with a solidus temperature of 200° C. to 260° C. The first solder alloy includes an Sn—Cu alloy or an Sn—Cu—Ag alloy. The solder paste further includes a second solder alloy powder in an amount ranging from 5% to 70% by weight, and a solder flux. The second solder alloy powder includes a second solder alloy with a solidus temperature below 250° C. The solder paste has a variable melting point. In multiple reflow soldering, a remelting of the solder paste is inhibited under different temperature conditions so that no functional failure occurs during assembly and/or packaging of PCBs or electronic devices due to melting of solder.

Sn—Cu mixed alloy solder paste, method of making the same and soldering method

A pressure sensor system including at least one pressure sensor unit, the pressure sensor unit being configured with at least one sensor element which is situated in a cavity of a support structure, signal processing elements being integrated into support structure, the at least one sensor element being embeddable into the support structure to form the pressure sensor unit, and the support structure being formed by a land grid array/mold premold structure (LGA/MPM). The pressure sensor unit is introduced into a sensor housing to be provided with a diaphragm and is supported therein, a residual volume of the sensor housing, which is provided with at least one diaphragm and to the wiring of which the pressure sensor unit is electrically connected, being filled with an incompressible fluid. Also described is a method for manufacturing such a pressure sensor system and a measuring device.

Pressure sensor system, measuring device and method for the manufacture thereof having a support structure being formed by a land grid array/mold premold structure

A pressure sensor device of a pressure sensor, in particular a low- or medium-pressure sensor, for example a tire-pressure sensor, includes a sensing device that has a sensing side that can be turned toward a sensing environment having a fluid to be sensed; and, directly and/or indirectly on the sensing side, a fluid-pressure transmitting device, through which a fluid pressure of the fluid to be sensed is transmittable to the sensing device.

Pressure sensor device and pressure sensor with a pressure transmitter providing pressure of a fluid to be sensed to the pressure sensor device and sensor

A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.

Method for producing a microelectromechanical component and wafer system

A sensor device () for use in a motor vehicle includes a housing () for receiving a sensor element (). The sensor element () has contact surfaces (to) electrically conductively connected with electrical plug connections () arranged in the housing (), in the region of contacts (to), wherein the sensor element () is applied with force by a housing element (), in the direction of the contacts (to) for the purposes of electrical contacting. A support in the form of a 3-point contact is formed between the sensor element () and the housing (). The sensor element () has at least two measuring devices (), and the at least two measuring devices () have three contact surfaces (to) that form the 3-point contact.

Sensor device, in particular for use in a motor vehicle

A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.

Micromechanical pressure sensor

In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.

Sensor module for accommodating a pressure sensor chip and for installation into a sensor housing

An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Solder joint inspection

A sensor module is provided having a sensor element, a housing and a substrate, the sensor element being situated on the substrate and the sensor element is provided to be at least partially embedded in the housing; and the sensor module further having a compensation element for compensating for thermal deformations of the housing; the housing being essentially situated between the substrate and the compensation element.

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Kirchentellinsfurt, Germany

Eckart Schellkes