Biotronik Se Co. Kg

Dyconex Ag

Eckardt Bihler

Marc Hauer

Dirk Muessig

Jochen Held

René Toelke

Hubert Zimmermann

Daniel Schulze

Sven Johannsen

The disclosure relates to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.

Implant comprising embedded conductor track and production method

A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.

Diffusion barrier for implantable electrode leads

A medical implant includes a first component having a surface and a plurality of electrical contacts and a second component having a surface and a plurality of electrical contacts. Each contact of the first component contacts an assigned contact of the second component in an electrically conducting manner. A seal is disposed between the two surfaces for sealing the contacts. The seal and the two surfaces are formed of a thermoplastic material. The seal is fused to the two surfaces for sealing the contacts and the seal is meltable so as to separate the two components from one another. A method for producing a medical implant is also provided.

Detachable seal for medical implants

A strain sensor for capacitive strain measurement has a flat and electrically conductive first conductor element and a flat and electrically conductive second conductor element. The two conductor elements oppose one another and are laterally displaceable relative to one another, so that the two conductor elements, proceeding from a first condition, may be displaced relative to one another into a second condition. An overlap between the two conductor elements is different in the first condition from the second condition. First and second springs attach the conductor elements to first and second attaching regions of the strain sensor. The first attaching region is disposed at a first reference point of a body to be measured, and/or the second attaching region is disposed at a second reference point of the body to be measured.

Strain sensor for a medical devices with improved measurement sensitivity

A method for producing an electronic module includes providing a first substrate including at least one first electrical contacting surface, an electronic component including at least one second electrical contacting surface, and a first material layer made of a thermoplastic material including at least one recess extending through the material layer. The first substrate, the electronic component and the first material layer are arranged with the first material layer disposed between the first substrate and the electronic component, and the at least one first electrical contacting surface, the at least one second electrical contacting surface and the at least one recess aligned relative to one another. The first substrate, the electronic component and the material layer are thermocompression bonded. A joint formed between the at least one first electrical contacting surface and the at least one second electrical contacting surface is surrounded or enclosed by the first material layer.

Thermocompression bonding of electronic components

The disclosure related to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.

An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.

Electronic module and method for producing same

An implantable electrode having a connection portion. So as to be able to easily stretch the electrode lengthwise, provision is made so that the connection portion is embodied in a coiled manner.

Extendable electrode

An implantable electrode and a process to produce an implantable electrode. To make it possible to produce the implantable electrode in a simple and economical manner, a connection cable of the electrode is at least partly embedded in a sheath of the electrode and the sheath is in the shape of a hollow cylinder.

Implantable electrode with hollow cylindrical sheath

A method for producing a medical electrode lead or a catheter, and also to an associated semifinished product. The semifinished product for this purpose includes a cable having at least one electrical conductor, which is embedded in a sheath made of an electrically insulating, thermoplastic material. It is characterized in that the cable, at least at one cable end, forms a connection point, via which the conductor can be attached permanently and non-detachably to further components, wherein part of the surface of the conductor is exposed in the region of the connection point and forms a contact face, and the sheath has, in the region of the connection point, a recess that is continuous in the longitudinal direction of the cable.

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Winterthur, Switzerland

Eckardt Bihler