Ems Inventa Ag

3d Systems, Inc.

Ems-chemie Ag

Ems-patent Ag

Eberhard Kinkelin

Gerhard Poessnecker

Jurgen Spindler

Paul Stenson

Andreas Kaplan

Raffaele Martinoni

Paul Boehler

J&uuml;rgen Spindler

Gerhard Pössnecker

Manfred Hoppe

Rene Gisler

Klaus Bender

Ralf Hoppe

Gunther Schäch

Jürgen Spindler

Gerhard P&ouml;ssenecker

Harrie Dipl-Ing Van Liempt

Powder compositions and articles and methods of forming articles from powder compositions are provided. The powder compositions include at least one powder that preferably includes an amount of one or more branched polymers such as, for example, one or more branched polyamide polymers. The powder composition is preferably capable of being formed, via a layer-by-layer sintering process such as, for example, selective laser sintering, into a three-dimensional article.

Powder compositions and methods of manufacturing articles therefrom

A binding fiber having, as at least one first thermoplastic component, a copolyamide which has a relative viscosity of at least 1.50 (measured at 0.5% in m-cresol at 25&#xb0; C.), a MVR of maximum 20 cm/10 min at 190&#xb0; C. and 2.16 kg load, a hydrophobicity of less than 7.2, a melting temperature lower than 105&#xb0; C. in the water saturated condition and a higher melting temperature in the dry condition. The binding fiber can, on the one hand, be activated with hot steam at approximately ambient pressure during the manufacture of flat materials containing natural fibers, such as paper, cardboard, wood fiber boards, or fiber mats. The finished flat material can, on the other hand, be subjected to higher temperatures, and the copolyamide develops good bonding with respect to the cellulose fibers normally used in the indicated flat materials.

Binding fiber for bonding of flat material containing natural fibers

Low-melting copolyamide and their use as hot-melt adhesives

A heat settable, coating system of carboxyl-functional polyester resins, polyfunctional epoxy compounds and/or &bgr;-hydroxy alkyl amides, as well as further customary additives, if required. The coating system contains at least one linear carboxyl-functional polyester resin of up to 10 mol-part of isophthalic acid and at least 90 mol-parts of at least a further dicarboxylic acid from the group of aromatic dicarboxylic acids with 8 to 16 C-atoms, aliphatic dicarboxylic acids with 6 to 22 C-atoms and cycloaliphatic dicarboxylic acids with 8 to 16 C-atoms, and at least 90 mol-parts of at least one branched aliphatic diol with 4 to 12 C-atoms, and up to 50 mol-parts of at least one linear aliphatic diol with 2 to 22 C-atoms and/or at least one cycloaliphatic diol with 6 to 16 C-atoms as the binder resin. Also a process for producing thermosetting coating systems of carboxyl-functional polyester resins, wherein binder resin, at least one cross-linking agent from the group of polyfunctional epoxy compounds and &bgr;-hydroxy alkyl amides and, if required, further customary additives are mixed into the melt at 90 to 130&deg; C., extruded, removed, granulated, comminuted and screened to a size of less than 100 &mgr;m. Finally, uses of the thermosetting coating system and of a protective layer produced from this coating system.

Coating system settable by heat

Novel, quick-crystallizing hot-melt adhesive masses having a melting point between 60&deg; and 100&deg; C. comprise a statistically-proportioned copolyester or copolyetherester based on terephthalic acid, adipic acid and a mixture of aliphatic diols; the molar proportion of terephthalic acid is between 55 and 85 mole %, relative to the total acid quantity; and the molar proportion of adipic acid is between 15 and 40 mole %. A combination of butane diol and hexane diol is used as the diol component; the molar component of butane diol is between 40 and 55 mole %; and the molar proportion of hexane diol is between 40 and 60 mole %. Up to 15 mole % of a dimer acid having a molar mass between 400 and 800 g/mole, or up to 10 mole % of a higher-molecular polyethylene glycol having a molecular mass of 600 to 4000 g/mole, can be used to increase the flexibility. The copolyester or copolyetherester hot-melt adhesive masses of the invention can be used in the hot-melt method, and in powder-form coating methods.

Low-melting copolyester and copolyetherester hot-melt adhesives

The invention relates to Amorphous and/or semicrystalline copolyesters containing .beta.-hydroxyalkylamide groups according to formula (I) ##STR1## whereinP=polymer chain of the polyester

Amorphous and/or semicrystalline copolyesters containing

The invention relates to novel hot-melt masses consisting of a statistically built-up copolyether ester based on terephthalic acid and a mixture of aliphatic diols. Terephthalic acid is used as the single acid component and its molar amount, relative to the total amount of acid, is 100 molar %. A combination of butane diol, diethylene glycol, polyethylene and optionally triethylene glycol is present as diol component. The molar amount of butane diol is less than 75 molar %, the amount of diethylene glycol is between 5 and 60 molar %, the amount of triethylene glycol between 0 and 40 molar % and at least 2 and at the most 10 molar % of a higher-molecular polyethylene glycol component with a molar mass of 600-4000 g/mole is used, relative to the total acid amount and total diol amount of 100 molar % in each instance. The melting point of the copolyether ester adhesive masses is between 90.degree. and 190.degree. C. The copolyetherester hot-melt masses can be used in the hot-melt method and for the known other powder coating methods.

Copolyether ester hot-melt masses

The invention relates to novel hot-melt masses consisting of a statistically built-up copolyether ester based on terephthalic acid in a mixture of aliphatic diols. Terephthalic acid is used as the single acid component and its molar amount, relative to the total amount of acid, is 100 molar %. A combination of butane diol, triethylene glycol and polyethylene glycol is present as diol component. The molar amount of butane diol is less than 80 molar %, the amount of triethylene glycol is between 15 and 60 molar % and at least 2 and at the most 10 molar % of a higher-molecular polyethylene glycol component with a molar mass of 600-4000 g/mole is used, relative to the total acid amount and total diol amount of 100 molar % in each instance. The melting point of the copolyether ester adhesive masses is between 90.degree. and 180.degree. C. The copolyetherester hot-melt masses can be used in the hot-melt method and for other known powder coating methods.

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Chur, Switzerland

Eberhard Kinkelin