Genesis Technology Usa, Inc.

Adc Telecommunications, Inc.

Matsushita Communication Industrial Corporation of America

Matsushita Communications Industrial Corporation

Earl Anthony Daughtry

Ronald L Hodge

Richard M Stone

Mark A Ruff

Robert Colantuono

Christopher S Quire

Peter Sung Tri Hoang

Glen Brian Backes

Jeffrey Oramel Brown

Thomas Baxter Harton, Iv

Chi-Lun Lin

Taochuan Chen

Shuojun (Tony) Duan

Kazem Memarzadeh

Yi Fei Luo

Anthony T Depoy

Roy Charles Reese

Peter Sung Hoang

An electrical connecter (), such as a jack, has a mating end (), a first barrel (), an optional collar (), a second barrel (), a body end (), a center receptacle (), a first solid dielectric () at the mating end of the first barrel, and second solid dielectric () at the body end () of the second barrel. The first section of the barrel has a smooth and uniform outer wall (A). This allows the inner diameter (DIS) of the first section of the barrel to be increased without reducing the thickness (T) of the first section of the barrel below a minimum value, and allows the outer diameter (DOC) of the center conductor in the vicinity of the first section of the barrel to be increased to provide for a greater current-handling capability. This provides for maintaining a desired impedance even with the greater current-handling capability.

Impedance-matched high-current G-type RF connector

An electrical connector () has a body, a center conductor (), and an insulator (). The body has a receptacle end (), a board end () having a rear plane () and a plurality of fastener holes for a plurality of fasteners (), a void extending from the receptacle end to the board end, and a grounding feature () substantially surrounding the void at the board end, the grounding feature extending beyond the rear plane and being approximately in the shape of a 'V' having a base which points away from the rear plane. The center conductor is in the void and extends from the receptacle end to beyond the rear plane of the board end. The insulator is in the void and substantially surrounds the center conductor in the void.

RF connector with V-grooved EMI sealing interface

A connector (), such as a plug or a receptacle, has reduced cross-talk. The connector has a conductive plate (), first and second insulators (A,B) on either side of the conductive plate, leads () outside of the insulators, the leads being formed from first and second lead-frames, at least one of the leads () having at least one tab or extension () which capacitively or conductively couples the lead to the conductive plate. The plate () may include an extension shaft (), and a lateral extension () from a lead may be placed into contact with the shaft. A lateral extension (E) formed on a rear portion of a lead may be placed into contact with a rear portion of the conductive plate (B) or with an opposing lead. Some of the leads may include severable tie bars ().

Three dimensional lead-frames for reduced crosstalk

A blind-mate connector () has a barrel (), a base () at the back end of the barrel, an insulator () mounted in the base, and a center conductor () extending from near the front end of the barrel, through the insulator, and extending beyond the back end of the base, with the center conductor being held by the insulator. One type has sidewalls () extending rearwardly from the back end of the base, and alignment notches () on the sidewalls, the alignment notches extending only partially from the back ends of the sidewalls toward the base. Another type has alignment tabs () extending rearwardly from the back end, and sidewalls () extending rearwardly from the back end of the base, the first tab being above the first sidewall.

Blind-mate connector having sidewalls with notches for alignment

A heat-dissipating EMI/RFI shield () has a shield base (), a shield cap (), and a heat sink (). The shield base has at least one sidewall () which defines an open area (). At least one mounting leg () extends from the sidewall and is affixed to a printed circuit board (). The shield cap has a collar () which defines an opening in the shield cap. The shield cap is configured to be mated to the shield base. The heat sink has a boss () extending therefrom. The heat sink is configured to be mated to the shield cap. The boss is configured to protrude at least partially into the opening in the shield cap and to make thermal contact with a selected heat generating component () on the printed circuit board.

Heat-dissipating EMI/RFI shield

A magnetic connector system () having a cable-end connector () and a printed circuit board connector (). The cable-end connector has a ferro-magnetic strike plate (). The printed circuit board connector has plugs or bosses (A,B) which mate with corresponding sockets in the cable-end connector and are configured to properly align or orient the connectors. The plugs may include electrical contacts (AAB) which mate with corresponding electrical contacts in the cable-end connector. The printed circuit board connector has a magnet assembly () which is inserted or installed into a receiving area, and secured by retainers, after the printed circuit board connector has been wave- or reflow-soldered to a printed circuit board. The magnet assembly and the strike plate hold the cable-end connector and the printed circuit board connector together.

Heat resistant magnetic electrical connector

An F-connector for a coaxial cable has a substantially flush, coplanar face comprising a first insulator, locking ring, and connector body with a swaged leading edge. Within the connector body a connecting lead is attached to and spans between the first insulator and a second insulator. The F-connector may be constructed by a process that permits front-loading of the connecting lead and insulators, or by a process that permits back-loading of the connecting lead and insulators, or by a process that permits partial back-loading and partial front-loading of the connecting lead and insulators.

F-connector with chamfered lock ring

A connector (), such as but not limited to a coaxial female F-connector, has an integral surge protector. The F-connector includes a connector body () with an extended center conductor lead (). Attached to the F-connector and substantially surrounding the lead is an inductor, such as a toroid core () having windings () thereon. In one configuration one end () of the windings is attached to the center conductor lead and the other end () is attached to an electrical ground. In another configuration that other end is attached to a circuit ground via a capacitor, a power supply, or a biasing circuit. The inductor serves to shunt a surge to ground. A series capacitor is connected between the center conductor lead and an input/output port on an electronic circuit, passes the desired signal, and further helps to prevent a surge from reaching the device.

F-connector with integrated surge protection

This disclosure is directed to apparatuses, systems, and methods associated with a connector assembly for use with surface mount technology (SMT). The connector assembly has a connector header configured to be mounted to a circuit board and is constructed of a high-temperature resistant material suitable for use with a reflow soldering process. The connector header includes at least one connector socket and at least one mounting shoulder, and is configured to be coupled to a header attachment assembly. The header attachment assembly comprises at least one connector pin and at least one mounting shoulder, and is configured to be coupled to the connector header. An electronic device, such as a card reader or hard drive, may be connected to the header attachment assembly and thereby to the circuit board. The connector assembly allows for the obstructed view inserting and attaching in a manual or an automated assembly process.

Two-piece connector assembly for connecting an electronic device to a circuit board

A network amplifier is provided. The network amplifier includes a variable equalizer having at least one control input and a variable attenuator having at least one control input. The network amplifier also includes at least one amplifier circuit that is coupled in series with the variable equalizer and the variable attenuator in a signal path of the network amplifier. The network amplifier also includes an automatic gain control circuit with a processor that monitors signals in the signal path and generates control signals for the control input of the variable equalizer and the control input of the variable attenuator to control at least one characteristic of the network amplifier.

Network amplifier with microprocessor control

A reverse path signaling circuit is described which provides less noise and interruption when injecting signals upstream to a head end. The reverse path signaling circuit includes a low pass filter, a status monitor, and a common emitter amplifier. The common emitter amplifier has a emitter region which couples to the status monitor. The status monitor couples to the common emitter amplifier as a single-ended input to the to the emitter region. The status monitor injects status monitor signals into the emitter region for passing the status monitor signals upstream to a head end. The low pass filter is coupled to another input on the common emitter amplifier. An output from the common emitter amplifier is taken at a collector region. The reverse path signaling circuit of the present invention does not require the use of a directional coupler as part of the circuit. Systems and methods are further included within the scope of the present invention.

Reverse path upstream signaling for status monitoring

Avariable equalizer is described. The variable equalizer provides for independent control of a number of breakpoints in the frequency response of the equalizer so as to allow the equalizer to be readily tuned to compensate for the tilt of coaxial cables over a wide range of characteristic attenuation. In one embodiment, the variable equalizer includes a two port bridge &ldquo;T&rdquo; network with variable top and bottom branches that are independently and selectively adjusted to create a desired frequency response. For example, in one embodiment, the top branches include a number of variable RC networks and the bottom branches include a number of variable LR networks. In some embodiments, PEN diodes provide the variable resistance in these LR and RC networks.

Variable equalizer with independently controlled branches based on different frequency breakpoints

A variable attenuator formed from a combination of PIN diodes is provided. The PIN diodes may be coupled in a &ldquo;T,&rdquo; &ldquo;p&rdquo; or other appropriate configuration. At radio frequencies (RF), a PIN diode acts as a variable resistor with a resistance value based on the bias current of the PIN diode. To control the attenuation level of the variable attenuator, the bias current of the PIN diodes are selectively adjusted. Digital values relating to selected bias currents, and thus selected attenuation levels, are stored in a memory. These digital values are provided as control signals that set the bias current levels for the PIN diodes. The bias current levels control the attenuation level of the variable attenuator.

Variable attenuator

A monitoring circuit is provided. The monitoring circuit can be used to monitor signals in a cable network. The monitoring circuit includes first and second stages. The first stage has an input and an output. The input is coupled to an external circuit. The first stage scales a voltage received at its input. The second stage is coupled to the output of the first stage. The second stage has a high input impedance and a low output impedance. The second stage buffers a signal at the output of the first stage to an output of the second stage.

Growing community of inventors

Lawrenceville, GA, United States of America

Earl Anthony Daughtry