Inertech IP LLC

Ietip LLC

Earl Allan Keisling

John Costakis

Gerald McDonnell

Ming Zhang

Michael Welch

Ken Nguyen

Gerald Mcdonnell

Gerald McDonneli

A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

Space-saving high-density modular data systems and energy-efficient cooling systems

The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

Cooling systems and methods using two circuits with water flow in a counter flow and in a series or parallel arrangement

An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.

Air flow distribution system for data center server racks

The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.

System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling

A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

Systems and assemblies for cooling server racks

System and methods utilizing fluid coolers and chillers to perform in-sertes heat rejection and trim cooling

A cooling system is provided including a first evaporator coil in thermal communication with an air intake flow to a heat load, a first liquid refrigerant distribution unit in fluid communication with the first evaporator coil to form a first fluid circuit, a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in the thermal communication with the air intake flow to the heat load, a second liquid refrigerant distribution unit in fluid communication with the second evaporator coil to form a second fluid circuit, a water loop in thermal communication with the first fluid circuit and second fluid circuit, and a chiller loop in thermal communication with the water loop.

Cooling systems and methods using two circuits with water flow in series and counter flow arrangement

Cooling systems and methods use first and second evaporators and first and second liquid refrigerant distribution units to increase the efficiency of the cooling systems and methods. The first evaporator is in thermal communication with an air intake flow to a heat load, and the first liquid refrigerant distribution unit is in thermal communication with the first evaporator. The second evaporator is disposed in series with the first evaporator in the air intake flow and is in thermal communication with the air intake flow, and the second liquid refrigerant distribution unit is in thermal communication with the second evaporator. A trim compression cycle of the second liquid refrigerant distribution unit is configured to further cool the air intake flow through the second evaporator when the temperature of the first fluid flowing out of a main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.

Cooling systems and methods incorporating a plural in-series pumped liquid refrigerant trim evaporator cycle

Cooling systems and methods using two cooling circuits

A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.

Modular IT rack cooling assemblies and methods for assembling same

Systems and methods relating to a plural in-series pumped liquid refrigerant trim evaporator cycle are described. The cooling systems include a first evaporator coil in thermal communication with an air intake flow to a heat load, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further include a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil. A trim compression cycle of the second liquid refrigerant distribution unit is configured to further cool the air intake flow through the second evaporator coil when the temperature of the first fluid flowing out of the main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.

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Ridgefield, CT, United States of America

Earl Allan Keisling