Analog Devices,inc.

Advanced Manufacturing Control Systems Limited

Advanced Manufacturing Control System Ltd.

Eamon Hynes

William Allan Lane

Edward John Coyne

Oliver J Kierse

John M Wynne

John O'Dowd

William Hunt

Peter G Meehan

Colin Gerard Lyden

John R Martin

Bernard Patrick Stenson

Damien Joseph McCartney

Patrick G Crowley

James Martin

Cornelius Broderick

Thomas Lawlor

Gary O'Riordan

John Wynne

A weighing system for a waste-hauling vehicle having a front end loader with at least two arms for lifting a waste container, the weighing system comprising: an extensometer mounted on at least one arm of the front end loader, the extensometer secured to separate extensometer mounts so that the extensometer is operative to detect deflections in the front end loader arm in response to loads of varying weights; and a vehicle data hub in communication with the extensometer, the vehicle data hub operative to receive inputs from the extensometer and determine therefrom: (i) the weight of a waste container containing waste as the waste container is lifted by the front end loader for emptying into a waste receptacle on the vehicle; (ii) the weight of the waste container as it is lowered by the front end loader after the waste container has been emptied into the waste receptacle on the vehicle; and (iii) the net weight of the waste that was contained in the container.

Weighing system for a front-end-loading waste-hauling vehicle

A waste management system for associating a collected refuse bin with a corresponding user of that bin. The system comprises a GPS tracker unit on-board a collection vehicle for recording the GPS co-ordinates of each refuse bin during refuse collection therefrom by the collection vehicle. A central server is configured for communication with each of a plurality of collection vehicles so that the GPS co-ordinates of each refuse bin collected during a refuse collection may be communicated to the central server. The server is further configured to effect a datastore lookup for comparing the GPS co-ordinates of the collected refuse bins with pre-recorded geographical data of a plurality of users for associating each refuse bin to a corresponding user.

Waste management system for associating refuse bins to corresponding users

A control aperture for an IR sensor includes a die; an IR sensor disposed on the die and an IR opaque aperture layer on the die having an IR transmissive aperture aligned with the IR sensor for controlling the field of view and focus of the IR sensor.

Control aperture for an IR sensor

The invention provides a sensor including a first sensor element formed in a first substrate and at least one optical element formed in a second substrate, the first and second substrates being configured relative to one another such that the second substrate forms a cap over the first sensor element, the at least one optical element being configured to guide incident radiation on the cap to the first sensor element. The sensor also includes a reference sensor element whose output can be used to reference the output of the first sensor element.

Sensor

A radiation sensor device including an integrated circuit chip including a radiation sensor on a surface of the integrated chip, one or more electrical connections configured to connect between an active surface of the integrated circuit chip and a lead frame, a cap attached to said integrated circuit chip spaced from and covering said radiation sensor, the cap having a transparent portion defining a primary lens transparent to the radiation to be sensed, a secondary lens disposed in a recess proximate and spaced from said primary lens transparent to the radiation to be sensed, and an air gap between said primary lens and said secondary lens.

Radiation sensor device and method

The method provides a semiconductor structure and method for forming such a structure that provides for protection for resistive layers formed within the structure from contamination from adjacent layers. By encapsulating the resistive layer in a material that is resistant to the diffusion of contaminants it is possible to protect the resistive material during the processing required to manufacture the structure.

Encapsulated metal resistor

A sealed capacitive sensor includes a substrate having a diaphragm forming a first plate of a capacitor; a second fixed plate of the capacitor spaced from the diaphragm and defining a predetermined dielectric gap and a sealing medium connecting together the substrate and fixed plate in an integrated structure and hermetically sealing the gap.

Sealed capacitive sensor

An improved radiation sensor device includes a cap attached to an integrated circuit chip which has a radiation sensor on a surface with a cap spaced from and covering the radiation sensor; the cap and integrated circuit chip with radiation sensor are encapsulated in an encapsulant with a transparent portion of at least one of the cap and integrated circuit chip proximate the radiation sensor being exposed at the boundary of the encapsulant.

The invention provides a sensor array having a plurality of sensor elements formed in a first substrate and having a plurality of die temperature sensors located thereabout. Each of the die temperature sensors are configured to provide an output related to the temperature of the die on which they are located, the sensor elements providing an output indicative of the intensity of radiation incident thereon.

Die temperature sensors

The invention provides a sensor element formed in a first substrate and having a thermal barrier disposed between the sensor element and a heat source provided elsewhere on the first substrate. The thermal barrier includes at least one pair of trenches formed within the first substrate, individual trenches of the pair being separated by a cavity.

Thermal sensor with thermal barrier

A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.

Spaced, bumped component structure

A galvanically isolated charge balance system for a multicell battery includes a balancing circuit associated with each cell; each balancing circuit including a flying capacitor; a variable conductance switch; and a biasing circuit for the variable conductance switch; and a galvanically isolating MEMS switching device for selectively connecting the flying capacitor to a voltage supply to charge it to a predetermined voltage and to the biasing circuit for setting the variable conductance switch to adjust the charge on its associated cell to a preselected level.

Galvanically isolated charge balance system

The invention provides a thermal sensor having a first and second temperature sensing elements each being formed on a thermally isolated table in a first substrate.

Thermal sensor with increased sensitivity

A capacitive sensor including a housing having a hermetically sealed cavity, a plate in the cavity, a diaphragm forming a part of the cavity and spaced from the plate, a conductive layer on the first diaphragm, and a second conductive layer on the plate, the first and second conductive layers being the electrodes of a capacitor whose capacitance varies with the position of the diaphragm relative to the plate.

Capacitive sensor

The invention provides a sensor element formed in a first substrate and at least one optical element formed in a second substrate, the first and second substrates being configured relative to one another such that the second substrate forms a cap over the at least one sensor element, the at least one optical element being configured to guide incident radiation on the cap to the at least one sensor element.

Growing community of inventors

Raheen, Ireland

Eamon Hynes