Utac Headquarters Pte. Ltd.

Eakkasit Dumsong

Il Kwon Shim

Saravuth Sirinorakul

Roel Adeva Robles

Phongsak Sawasdee

Paweena Phatto

Kok Chuen Lock

Jiraphat Charoenratpratoom

Maythichai Saithong

Mike Jayson Candelario

The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.

Semiconductor packages with integrated shielding

A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.

Hermetic semiconductor packages

Growing community of inventors

Bangkok, Thailand

Eakkasit Dumsong