Cool Options, Inc.

Cool Shield, Inc.

Thermal Solution Resources, LLC

Cool Options, Inc. a New Hampshire Corp.

Other

Cool Optins, Inc.

E Mikhail Sagal

Kevin A McCullough

James D Miller

James Vernon Miller

Jeffrey J Panek

Gary R Arnold

Lyle James Smith

Kevin A Mccullough

An LED lighting device includes a light emitting assembly including at least one LED and a wireless network interface connecting the LED lighting device to a network. The wireless network interface includes a RF transceiver. An antenna is in electrical communication with the RF transceiver. A thermally conductive housing receives the light emitting assembly, the thermally conductive housing in thermal communication with the at least one LED. In one aspect the thermally conductive housing is formed of a thermally conductive and electrically nonconductive material. In another aspect, the thermally conductive housing includes a first portion attached to a second portion, wherein the first portion is formed of a first, thermally conductive material and defines an interior cavity receiving the wireless network interface. The second portion is formed of a second, electrically nonconductive material and defines an aperture allowing optical output of the at least one LED to pass therethrough.

LED lamps with enhanced wireless communication

In one aspect, an LED lighting apparatus includes an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side. At least one LED is mounted on the exterior side of the electronic circuit board central portion and a thermally conductive housing encloses said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material. The thermally conductive housing defines a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, wherein a portion of said thermally conductive housing being overmolded onto said peripheral portion. In a further aspect, a method of manufacturing an LED lighting apparatus is provided.

Overmolded LED light assembly and method of manufacture

An improved light emitting diode (LED) device with a thermoelectric module is provided. In the preferred embodiment, the LED device herein includes a heat sink/housing containing a LED light, heat slug, and LED circuit board attached to a first side of a thermoelectric module and a heat sink on a second side of the thermoelectric module. Heat is conducted from the LED light and through the circuit board to the first side of the thermoelectric module. The heat sink housing dissipates heat from the second side of the thermoelectric module to create a temperature differential across the thermoelectric module and generate electricity.

LED device with thermoelectric module

A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.

Polymer electronic device package having high thermal conductivity and dielectric strength

A method for making a thermoplastic, thermally-conductive interface article is provided. The method used to make the interface article involves injection-molding a moldable composition into molding members. The moldable composition contains a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The thermally-conductive articles can be used as thermal interfaces to dissipate heat from heat-generating electronic devices.

Method for making thermoplastic thermally-conductive interface articles

A thermally-conductive polymer composition suitable for making molded reflector articles having light-reflecting surfaces is provided. The composition comprises: a) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and b) about 20% to about 80% by weight of a thermally-conductive carbon material such as graphite. The composition can be used to make reflector articles such as housings for automotive tail lamps, head lamps, and other lighting fixtures. A method for manufacturing reflector articles is also provided.

Thermally-conductive plastic articles having light reflecting surfaces

The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Thermally conductive elastomeric pad

The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Thermally conductive elastomeric pad and method of manufacturing same

The present invention relates to a self-heating container for heating consumable items such as food and beverages. The container assembly includes a star-shaped inner container for holding heating media that produces an exothermic reaction, and an outer container for holding a consumable item such as food and beverages. The inner container includes a thermally conductive polymer composition, and the outer container includes a heat-insulating material. The thermally conductive polymer composition includes a base polymer matrix and filler material.

Self-heating food and beverage container made from a thermally conductive polymer composition

An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.

Molded electronic connector formed from a thermally conductive polymer composition and method of making the same

A light-emitting diode reflector assembly having a heat pipe and a reflector body is provided. The assembly further includes a mounting member for mounting a circuit board having an array of light-emitting diodes. The mounting member and reflector body are made from a thermally-conductive polymer composition comprising: i) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite.

Light-emitting diode reflector assembly having a heat pipe

The present invention discloses a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties. In addition, the present invention provides a method of manufacturing an elastomeric heat sink device as described above.

Elastomeric heat sink with a pressure sensitive adhesive backing

The electronic connector () includes an improved heat dissipating housing for cooling heat generating devices located within the connector (). The electronic connector () of the present invention enables the cost-effective cooling of electronic devices () within the connector () while realizing superior thermal conductivity and improved electromagnetic shielding. A method of forming an electronic connector () that includes the steps of first providing a heat generating electronic component () capable of electronically coupling two data devices together having a first port () and a second port (). This component () is typically mounted or installed into a circuit board (). An outer housing () of moldable thermally conductive polymer material () is overmolded around the heat generating electronic component () leaving the first port () and the second port () of connector () exposed.

Highly thermally conductive electronic connector

A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m&deg; K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Growing community of inventors

Wakefield, RI, United States of America

E Mikhail Sagal