Georgia Tech Research Corporation

E Kent Barefield

Walter J Lackey

William Brent Carter

David N Hill

John A Hanigofsky

Michael J Shapiro

A method for applying a metal film barrier layer between a substrate and a superconductor coating or over a superconductivity coating using chemical vapor deposition in which low vapor pressure reactants are used, is disclosed, which comprises the steps of providing a substrate and a quantity of metal-bearing reagent and one or more reagents, placing the substrate within the furnace, introducing the metal-bearing reagent by a powder feeder means and then the reagents at different times into and reacting them in the furnace, resulting in the deposition first of a coating of metal onto the substrate and then of a coating consisting essentially of the superconducting reactant components onto the metal film; said reagents generally chosen to yield the group of oxide superconductors.

Method for the chemical vapor deposition of group IB and group VIIIB

A method for applying coatings to substrates using chemical vapor deposition with low vapor pressure reagents is disclosed which comprises the steps of: (a) placing a substrate in a furnace means; (b) directly introducing powder reagents by a powder feeder means into said furnace means; and (c) vaporizing and reacting said reagents within said furnace means resulting in the deposition from the vapor phase of a coating on said substrate, wherein said coating can be an oxide superconductor.

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Decatur, GA, United States of America

E Kent Barefield