Micron Technology Incorporated

Round Rock Research, LLC

Winbond Electronics Corporation

Other

Crossbar, Inc.

Dzung Huu Nguyen

Vishal Sarin

Hagop A Nazarian

Aaron S Yip

Benjamin S Louie

Jin-Man Han

Jonathan Pabustan

William Henry Radke

Frankie F Roohparvar

Jung Sheng Hoei

Lin-Shih Liu

William Saiki

Jason Guo

Sang Thanh Nguyen

Tianhong Yan

Cung Vu

John D Nguyen

Youssef Yassine

A detection circuit that can detect a two-terminal memory cell changing state. For example, in response to electrical stimuli, a memory cell will change state (e.g., to a highest resistance state), but existing techniques do not detect this state change until after the stimuli is completed and a subsequent sensing operation (e.g., read pulse) is performed. The detection circuit can detect the state change during application of the electrical stimuli that causes the state change.

State change detection for two-terminal memory during application of a state-changing stimulus

Methods for sensing, method for programming, memory devices, and memory systems are disclosed. In one such method for sensing, a counting circuit generates a count output and a translated count output. The count output is converted into a time varying voltage that biases a word line coupled to memory cells being sensed. Target data for each memory cell is stored in a data cache associated with that particular memory cell. When it is detected that a memory cell has turned on, the translated count output associated with the count output that is indicative of the voltage level that turned on the memory cell is compared to the target data. The comparison determines the state of the memory cell.

Sensing operations in a memory device

In an embodiment, a defective memory block is replaced with a non-defective memory block, and a voltage-delay correction is applied to the non-defective memory block that replaces the defective memory block based on the actual location of the non-defective memory block.

Applying a voltage-delay correction to a non-defective memory block that replaces a defective memory block based on the actual location of the non-defective memory block

Programming operations in a memory device

System and method for executing a global memory command in a multi-chip non-volatile memory device having a plurality of non-volatile memories. The global memory command is received at each non-volatile memory concurrently. The memory command is initiated at different times relative to receiving the global memory command for at least two of the plurality of non-volatile memory to mitigate peak power consumption.

Apparatus and method for reduced peak power consumption during common operation of multi-nand flash memory devices

The present disclosure includes methods, devices, and systems for access line biasing. One embodiment includes selecting, using a controller external to the memory device, a particular access line dependent biasing scheme and corresponding bias conditions for use in performing an access operation on an array of memory cells of the memory device, and performing the access operation using the selected particular access line dependent biasing scheme and corresponding bias conditions. In one or more embodiments, the selected particular access line dependent biasing scheme and corresponding bias conditions is selected by the controller external to the memory device based, at least partially, on a target access line of the array.

Access line dependent biasing schemes

An apparatus has a controller. The controller is configured to address a non-defective memory block of a sequence of memory blocks in place of a defective memory block of the sequence of memory blocks such that the non-defective memory block replaces the defective memory block. The non-defective memory block is a proximate non-defective memory block following the defective memory block in the sequence of memory blocks that is available to replace the defective memory block. The controller is configured to apply a voltage-delay correction to the non-defective memory block that replaces the defective memory block based on the actual location of the non-defective memory block.

Replacing defective memory blocks in response to external addresses

A method of reading sequential pages of flash memory from alternating memory blocks comprises loading data from a first page into a first primary data cache and a second page into a second primary data cache simultaneously, the first and second pages loaded from different blocks of flash memory. Data from the first primary data cache is stored in a first secondary data cache, and data from the second primary data cache is stored in a second secondary data cache. Data is sequentially provided from the first and second secondary data caches by a multiplexer coupled to the first and second data caches.

Increased NAND flash memory read throughput

A target memory cell of a memory device is programmed by applying a programming voltage to a word line that includes the target memory cell, determining whether the target memory cell is programmed, and increasing the programming voltage by a step voltage if it is determined that the target memory cell is not programmed. An initial programming voltage and the step voltage are each selectable after fabrication of the memory device.

Programming memory devices

Electronic systems and methods of operating memory devices are provided. In one such embodiment, a memory device receives an external address that addresses a non-defective memory block of a sequence of memory blocks of the memory device in place of a defective memory block of the sequence of memory blocks such that the non-defective memory block replaces the defective memory block. The non-defective memory block is proximate non-defective memory block following the defective memory block in the sequence of memory blocks that is available to replace the defective memory block.

In erasing a memory block of memory cells, a semiconductor tub that contains a memory block to be erased can be biased with a high, positive voltage. The control gates of the memory cells that make up the memory block can be biased with a negative voltage. An erase verification can then be performed to determine if the memory block has been successfully erased. If the memory block has not been erased, the erase operation of biasing the tub with the positive voltage and the control gates with the negative voltage can be repeated until the erase verification is successful.

Erase voltage reduction in a non-volatile memory device

Controllers and memory devices are provided. In an embodiment, a controller is configured to address a non-defective column of memory cells of a memory device in place of a defective column of memory cells of the memory device in response to receiving an address of the defective column of memory cells from the memory device. In another embodiment, a memory device has columns of memory cells and is configured to receive an external address that addresses a non-defective column of memory cells of a sequence of columns of memory cells of the memory device in place of a defective column of memory cells of the sequence of columns of memory cells such that the non-defective column replaces the defective column. The non-defective column is a proximate non-defective column following the defective column in the sequence of columns that is available to replace the defective column.

Growing community of inventors

Fremont, CA, United States of America

Dzung Huu Nguyen