Asml Netherlands B.v.

Dylan John David Davies

Richard Joseph Bruls

Johan Gertrudis Cornelis Kunnen

Paul Janssen

Maxim Pisarenco

Frederik Eduard De Jong

Kornelis Tijmen Hoekerd

Ronald Van Der Wilk

Marc Hauptmann

Jorge Alberto Vieyra Salas

Willem Richard Pongers

Chung-Hsun Li

Georgios Tsirogiannis

Johan Franciscus Maria Beckers

Antonius Hubertus Van Schijndel

Juan Manuel Gonzalez Huesca

Hendrik Cornelis Anton Borger

Petrus Johannes Van Den Oever

Edwin Johannes Maria Janssen

Arnaud Hubaux

Ajinkya Ravindra Daware

Andriy Hlod

Naoko Tsugama

A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.

Method for decision making in a semiconductor manufacturing process

A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.

Methods and apparatus for obtaining diagnostic information relating to a lithographic manufacturing process

Method and apparatus for obtaining diagnostic information relating to a lithographic manufacturing process, lithographic processing system including diagnostic apparatus

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Heeswijk-Dinter, Netherlands

Dylan John David Davies